| Allicdata Part #: | ATS-03H-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to transfer the heat generated by electronics components into the air. The ATS-03H-126-C1-R0 is an excellent choice for this application. It is a high-performance, high-quality heat sink that excels in both performance and longevity.
The ATS-03H-126-C1-R0 is a lightweight aluminum extrusion that is designed to dissipate heat quickly and efficiently. The design includes an optimized fin stack, a unique faceted geometry, and an internal air path that distributes heat evenly. This makes it ideal for use in a variety of applications where reliable heat dissipation is necessary. It is compatible with a variety of popular components, including CPUs, GPUs, and logic boards.
The ATS-03H-126-C1-R0 is designed to be used in conjunction with additional thermal solutions, such as heat pipes or fans. This allows for the heat sink to work more effectively, as it can be supplemented by additional cooling options. The heat sink also features a number of mounting options, which makes it much easier for it to be integrated with other components. The mounting options also make it easy to retrofit existing solutions.
The working principle of the ATS-03H-126-C1-R0 is simple. Heat is generated by the components, and then is transferred to the heat sink. The heat sink then dissipates the heat away from the components using convection. This is accomplished through the use of a fin stack, which is a series of fins that increase the surface area of the heat sink. As air passes over the fins, heat is dissipated into the surrounding air.
The ATS-03H-126-C1-R0 is an incredibly reliable and effective heat sink solution. It is perfect for a variety of applications, such as cooling CPUs, GPUs, and logic boards. It is lightweight and easy to mount, and offers optimal cooling performance. It is also very cost-effective, making it a great choice for any thermal solution.
The specific data is subject to PDF, and the above content is for reference