| Allicdata Part #: | ATS-03H-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-03H-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to the ATS-03H-15-C3-R0 Thermal - Heat Sink
The ATS-03H-15-C3-R0 thermal - heat sink is a thermal component designed for electronic systems. It is composed of a metal plate and fins, using convection as a cooling mechanism.
A heat sink is a device used to transfer heat away from electronic systems. It is a metal plate with fins used to dissipate heat. In the ATS-03H-15-C3-R0, the metal plate is composed of aluminum with a hard anodized finish which helps to increase the efficiency of the heat transfer, ensuring proper thermal management.
Application Field
The ATS-03H-15-C3-R0 is designed for applications such as communication and industrial control, computers and network systems, to name just a few. It is specifically designed to work in systems which require high dissipated power, low pressure drop, and low noise. It is also designed for applications in which heat sinks are used in the place of heat pipes.
The ATS-03H-15-C3-R0 is also suitable for devices that require low-profile cooling solutions. The design of the heat sink allows for the metal plate to be mounted rigidly to the PCB, while the fins ensure efficient dissipation of the heat.
Working Principle
Heat sinks work by transferring heat generated by electronic components, such as CPUs and GPUs, away from them. The heat is conducted through the metal plate of the heat sink and dissipated by fins. This ensures that the components generate heat but do not overheat which can lead to their failure.
The ATS-03H-15-C3-R0 transfers the heat via three methods: conduction, convection, and radiation. The metal plate conducts the heat to the fins which then dissipate the heat via convection as air flowing past the fins carries the heat away. Heat is also transferred away from the fins via radiation as the heat radiates from the fins to the surrounding air.
The design of the heat sink allows for efficient cooling while maintaining a low profile design. Heat dissipation is increased by the deep fins, which are designed to better transfer heat away from the components. The hard anodized finish on the metal plate of the heat sink helps to maximize the efficiency of the heat transfer.
Conclusion
The ATS-03H-15-C3-R0 thermal - heat sink is designed for applications requiring high dissipated power, low pressure drop, and low noise. The use of aluminum with a hard anodized finish for the metal plate ensures optimal thermal management is achieved, while the fins allow for efficient heat dissipation. The heat is transferred away from the system components by conduction, convection, and radiation. The design of the heat sink ensures efficient dissipation while maintaining a low profile design.
The specific data is subject to PDF, and the above content is for reference