| Allicdata Part #: | ATS-03H-182-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-182-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-182-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks, sometimes referred to as radiators, are devices used to transfer heat away from a source object such as an electronic device or circuitry, and into a cooler ambient environment. Heat sinks are commonly used in many consumer electronics and industrial applications. Heat sinks are typically constructed of metals, such as aluminum or copper, which boast great thermal conductivity properties. In this article, we will look at the application field and working principle of the ATS-03H-182-C1-R0 Heatsink.
The ATS-03H-182-C1-R0 heatsink is a thermal management device designed to address the rising heat associated with modern electronics and increase the thermal capacity of a circuit board. It features a copper base and a fan that work together to provide comprehensive cooling. The copper base has a thick surface that spreads and dissipates heat quickly, providing robust heat dissipation and improved airflow. The fan is designed to circulate air around the surface of the copper base, providing additional convection cooling.
The ATS-03H-182-C1-R0 heatsink is well suited for use in a variety of applications, including laptops, tablets, servers, desktops, cell phones, and other consumer electronic products. It is also well suited for industrial applications, such as in mining and automotive applications. In short, anywhere that heat dissipation is necessary, the ATS-03H-182-C1-R0 heatsink can be used effectively.
The working principle of the ATS-03H-182-C1-R0 heatsink is as follows: Heat is generated in the device or component being cooled, and then transferred away from the device via the heatsink. The heat is then dissipated through the heatsink, either by conduction through the metal base or by convection through the fan. This cooling action helps reduce the temperature of the device and prevent it from overheating.
The ATS-03H-182-C1-R0 heatsink is designed to provide efficient and reliable thermal management in a wide range of applications. Its copper base provides superior heat dissipation while its fan creates convection cooling to further increase its cooling power. This combination of thermal management features makes the ATS-03H-182-C1-R0 heatsink an ideal solution for cooling devices and components in consumer electronics and industrial applications.
The specific data is subject to PDF, and the above content is for reference