| Allicdata Part #: | ATS-03H-190-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-190-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-190-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management within an electronic system is critical for efficient and reliable operation of the components within the system, and thermal heat sinks are integral components of any system cooling solution. The ATS-03H-190-C1-R0 thermal heat sink is a great way to reduce the surface temperature of high power components while maintaining a low system profile. In this article, we will explore the application field and working principle of the ATS-03H-190-C1-R0 thermal heat sink.
Application Field
The ATS-03H-190-C1-R0 thermal heat sink is designed for mounting on aluminum or copper-based printed circuit boards, and is optimized for usage in applications that require high power output density. The small size and slender form factor of the heat sink make it ideal for applications that require a low system profile, such as automotive, medical, military, communication, and industrial electronics. The thermal heat sink is rated to dissipate a maximum of 190 watts, making it a great choice for high power components such as transistors, integrated circuits, dc motors, and solenoids.
The ATS-03H-190-C1-R0 features integrated heat pipes, which are closed-loop tubes that transfer heat away from the board and to the sides of the heat sink for better cooling performance. The heat pipes also absorb heat from the board more quickly than traditional aluminum or copper-based heatsinks, making the ATS-03H-190-C1-R0 an ideal choice for high-power applications.
Working Principle
The working principle of the ATS-03H-190-C1-R0 is based on the natural physical principles of conduction heat transfer. Heat energy generated by the components is conducted through the metal frame of the thermal heat sink. The integrated heat pipes help to transfer the heat energy away from the components, spreading the heat across the heat sink. This heat is then dissipated to the surrounding environment, resulting in improved system performance, extended component life, and improved cooling efficiency.
The integrated heat pipes are designed to optimize cooling performance, with a two-stage design that includes a hollow center and a series of channels to maximize contact with the air around the thermal heat sink. The aluminum cladding on the heat sink distributes the heat evenly, allowing for efficient thermal management. The high surface area of the aluminum fins helps facilitate thermal dissipation, further improving the cooling performance of the thermal heat sink.
In addition to the thermal benefits of the heat sink, it also offers several other advantages. It is designed to be robust and durable, with a powder-coated finish that helps protect against corrosion and oxidation. The mountable design of the thermal heat sink is compatible with many board designs, allowing easy integration into a wide range of systems. The compact size of the product ensures a low system profile, making it well suited for space-constrained applications.
The ATS-03H-190-C1-R0 thermal heat sink is an effective cooling solution for a range of power dense applications, offering superior performance in a space-saving package. Its integrated heat pipes and robust design make it a great choice for high-powered components, providing improved system performance and extended life. With its easy-mount system and wide compatibility, the ATS-03H-190-C1-R0 is the perfect choice for thermal management in demanding environments.
The specific data is subject to PDF, and the above content is for reference