| Allicdata Part #: | ATS-03H-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-195-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are designed to keep electronic components within their operational environment and reduce their surface temperature. The ATS-03H-195-C1-R0 heat sink is designed with unique features to optimize cooling performance, including fin area, fin height, fin baseplate design, airflow management, and heat spreader.
The fin area of the ATS-03H-195-C1-R0 heat sink allows cool air to pass over the fins and dissipate heat from the dissipator baseplate. The fin height is designed so that the maximum amount of air can pass over the fins, resulting in the highest level of thermal dissipation and cooling performance. The fin baseplate is also designed to provide optimal heat dissipation, allowing the air to flow freely around the fin body.
The ATS-03H-195-C1-R0 heat sink also features airflow management to ensure efficient heat dissipation. Airflow management is a technique which utilizes airflow in and around the heat sink to optimize cooling performance. The heat spreader on the backplate of the ATS-03H-195-C1-R0 heat sink is designed to spread the heat evenly over the entire area, enabling efficient thermal performance.
The main application fields of ATS-03H-195-C1-R0 heat sinks are in high-performance electronic components, such as CPUs, GPUs, power supplies, LED lighting, cell phone chargers and power adapters, HDD/SSD and other electronic components with high-temperature emissions. The heat sink is also commonly used in server racks, network cabinets, and other types of high-temperature environments. In addition, this heat sink is often used in applications with limited space in order to maximize the cooling capacity.
The working principle of ATS-03H-195-C1-R0 heat sinks is based on the fundamental principles of thermodynamics. Heat from the component is transferred to the heat spreader via a medium, typically a thermal paste, and then dissipated to the air using the thermal fins. The airflow management system harnesses the natural convection of the air to improve the thermal performance. The fastening system is designed to ensure that the fin assembly is secured in place.
In conclusion, ATS-03H-195-C1-R0 heat sinks are designed to optimize thermal efficiency and to keep the temperature of electronic components within their operational environment. The fin area, fin height, fin baseplate design, airflow management, and heat spreader work together to achieve maximum thermal performance. ATS-03H-195-C1-R0 heat sinks are commonly used in high-performance electronic components, server racks, network cabinets, and other types of high-temperature environments.
The specific data is subject to PDF, and the above content is for reference