| Allicdata Part #: | ATS-03H-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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When it comes to thermal management, it’s hard to find a more critical component than heat sinks. Heat sinks are the key component of thermal management systems, and the ATS-03H-20-C1-R0 is an excellent example of a thermal heat sink. Understanding the applications and principles behind the use of this device is essential for any engineer or technician involved in thermal management.
The ATS-03H-20-C1-R0 is a bonded fin, unidirectional, heat sink package. This device is designed for thermal performance up to 6.0 watt (20CFM) at 0.21 C/W. It’s an air-cooled skived fin heat sink that is constructed with lightweight aluminum construction. The heat sink is in direct contact with the heat source to ensure efficient heat transfer.
The ATS-03H-20-C1-R0 is used in a wide variety of applications, including CPUs, GPUs, FPGAs, and ASICs. It’s used in high-end servers, laptop computers and other high-end systems that require superior thermal performance. The device is designed for use in high-density, high-heat applications and can be used with a variety of fans and blowers to ensure efficient cooling.
The working principle behind the ATS-03H-20-C1-R0 is relatively simple. When the device is installed, it is placed in direct contact with the heat source. This allows for maximum heat transfer between the device and the heat source. The heat generated by the heat source is then dissipated by the heat sink’s skived fins, which transfers the heat away from the heat source.
The skived fins are designed to be maximally efficient at dissipating the heat. The fins are designed to be in direct contact with the air, which allows for maximum air flow and thus maximum heat dissipation. This ensures that the heat generated by the device is quickly and efficiently spread out across the entire heat sink, thus providing superior cooling performance.
The ATS-03H-20-C1-R0 is an excellent example of a thermal heat sink. It is designed for superior performance in high-density, high-heat applications and is capable of dissipating up to 6.0 watt (20CFM) at 0.21C/W. The device is designed for maximum efficiency, with skived fins that provide superior cooling performance. Understanding the applications and principles behind the use of this device is essential for any engineer or technician involved in thermal management.
The specific data is subject to PDF, and the above content is for reference