| Allicdata Part #: | ATS-03H-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-03H-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are small devices used in a variety of applications, and ATS-03H-30-C3-R0 is one of the most popular types used today. This particular heat sink is commonly used as a cooling device in electronic devices and other industrial applications. It works by dissipating unwanted heat away from delicate components or parts of the system. This heat sink connects to a power source and passes a current through its own fins, transferring the unwanted heat away.
A typical ATS-03H-30-C3-R0 heat sink is constructed with a metal alloy such as copper or aluminum. It has multiple interconnected fins that create a larger surface area. When a current is passed through the fins, the heat from the device being cooled is then transferred away from the part, to the fins. The larger the surface area of the fins, the more efficiently the heat can be dissipated.
Customers or consumers who need to cool their electronics with an ATS-03H-30-C3-R0 must make sure the heat sink they are using is custom built to fit their device. This is because each device will have a different amount of heat produced and the heat sink must be designed to handle this amount of heat. This heat sink also needs to have correct dimensions for the given application and must be securely attached to the device. Otherwise, it is not likely to provide the best performance.
The ATS-03H-30-C3-R0 heat sink is widely used in some electronics such as 3D printers, desktop computers, and some industrial-grade medical equipment. The heat sink is designed to help keep the device from overheating quickly or reducing the amount of energy it takes to keep it cool. The heat sink also helps minimize the amount of noise created by the device if it has fans or active cooling system, as the heat sink helps to reduce the amount of energy absorbed.
Since the ATS-03H-30-C3-R0 heat sink is made of metal alloys, it provides extra durability and reliability. Metal alloys are more resistant to wear and tear from long-term usage, and they are also more resistant to corrosion than other materials. This type of heat sink is also resistant to temperature fluctuations, which helps to ensure that the device does not overheat or cause any damage due to excessive temperatures.
The ATS-03H-30-C3-R0 is a great choice for cooling electronic devices as it is efficient and reliable. It has a long life span and is also easily customizable to meet specific application requirements. This thermal - heat sink is a popular choice among businesses and consumers alike because it can keep their devices running cooler and more efficiently. The cost-efficiency, customizability, and durability of this device make it a great choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference