| Allicdata Part #: | ATS-03H-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-03H-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an integral part of many industrial applications, from cooling of electronic components to the cooling of aerospace systems. The ATS-03H-32-C2-R0 is a high-powered heat sink that is used in many industries and applications. By understanding the application field and working principle of this heat sink, engineers can better assess how it will fit into their project requirements.
The ATS-03H-32-C2-R0 is designed for internal cooling of high-powered components, such as semiconductor chips, power transistors and other power components. It utilizes a combination of copper fin construction, soldered base plate construction, and extruded aluminum base construction. This combination of materials and construction techniques allow for extreme thermal efficiency and maximum design flexibility. The copper fins maximize the heat transfer rate to the external environment. The soldered base plate provides electrical insulation from the base plate to the fins. The extruded aluminum base plate provides maximum structural integrity and support.
The ATS-03H-32-C2-R0\'s power dissipation range is from 8.0 watts to 26.4 watts. The overall dimensions of the heat sink are 123 mm x 68 mm x 22.5 mm, with a maximum temperature rating of 105 °C. It has a 2-piece extruded aluminum base plate and 4x6 copper fin array. Its maximum airflow is 200 cubic feet per minute (CFM) with a maximum static pressure of 3.2 mm H2O.
The ATS-03H-32-C2-R0 is a versatile thermal - heat sink which can be used in many applications. It is often used in high-power computers and servers, as well as in industrial control systems and telecommunications equipment. It is also suitable for a variety of temperature control applications, such as heaters, fans, radiators, air conditioners, and air-handling systems. In addition, it can be used in medical and laboratory equipment, in safety and emergency systems, and as a safety component in consumer electronics.
The ATS-03H-32-C2-R0 works by dissipating heat from the component into the nearby environment. The air drawn into the heat sink absorbs the heat, and then exits out the top of the heat sink. This forced airflow keeps the heat sink components cool and prevents any significant overheating or structural damage. In order to maximize the thermal transfer efficiency, it is important to have adequate airflow and a low resistance thermal path from the component to the environment.
The ATS-03H-32-C2-R0 is an effective tool for cooling high-power components in a variety of applications. Its combination of copper fin construction, soldered base plate construction, and extruded aluminum base construction make it an extremely efficient heat sink. Its power dissipation range and overall dimensions make it suitable for a wide variety of temperature control applications. Through proper selection and installation of the ATS-03H-32-C2-R0, engineers can help ensure their projects are successful and safe.
The specific data is subject to PDF, and the above content is for reference