ATS-03H-46-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sink is a device used to dissipate a large amount of heat generated by electronic components, circuits, or systems. Heat sinks are most commonly used to cool electronic components such as transistors, CPUs, and GPUs. Heat sinks can be made from a variety of materials and come in many shapes and sizes, depending on their application. One of the most common types of heat sinks, ATS-03H-46-C3-R0, is widely used to cool CPUs, GPUs, and other microchips.

ATS-03H-46-C3-R0 Application Field and Working Principle

ATS-03H-46-C3-R0 is a heat sink fabricated from aluminum alloy, and is designed for cooling electronic chips and components in the fields of personal computers, laptops, and cellular phones. It has a combination of natural heat dissipation and forced cooling functions. The natural heat dissipation is achieved through the aluminum alloy construction which removes the heat generated by the CPU, GPU, or other microchip. The forced cooling is accomplished by an electric fan mounted to the heat sink, which forces air through the heat sink assembly, cooling the chips it has been mounted to.
The ATS-03H-46-C3-R0 heat sink consists of a copper base, aluminum fins, and an electric fan. The copper base is a flat plate that is in direct contact with the chips or components that need to be cooled. The copper base is attached to a metal frame which holds the aluminum fins in place. The aluminum fins form the bulk of the heat sink\'s body and are responsible for radiating the heat from the chips. The electric fan is attached to the fin assembly and is used to provide additional forced cooling by blowing air through the heat sink. As the air passes through the fins, the heat is dissipated, resulting in reduced temperature readings on the chips.
The ATS-03H-46-C3-R0 heat sink is designed to be versatile and easy to use. It can be mounted to a variety of chips including AMD, Intel, and ARM-based processors. The mounting hardware is included with the heat sink, making installation a breeze. The fan can be regulated with a manual speed selector or with an automatic temperature-based speed controller, depending on the chipload and the ambient temperature. The fan is also equipped with dust filters that keep the interior of the fan clean and free from dust, allowing the fan to work at its designed speed and airflow.
The ATS-03H-46-C3-R0 heat sink provides an efficient cooling solution for high-end chips and components. It is easy to install and maintain, and is capable of dissipating large amounts of heat from chips and components. With its combination of natural heat dissipation and forced cooling, the ATS-03H-46-C3-R0 is the ideal choice for cooling high-end CPUs, GPUs, and other microchips.

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