ATS-03H-66-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.77°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are devices, which are used for cooling electronic components, such as power transistors, integrated circuits and inverters. Heat sinks are typically constructed of aluminum and other thermally conducting materials, which are mated to a heat generating component, such as a microprocessor. Heat is transferred, resulting in cooling the component.The ATS-03H-66-C2-R0 heat sink, features a black anodized coating, which aids in the dissipation of heat even further. It is designed to manage high thermal loads, and is a perfect solution for specialized environments, where a combination of convenience, performance and heat dissipation ability is necessary.The heat sink has a large base area of 67 x 67mm, thus enabling it to dissipate heat more efficiently while protecting the chip from thermal overload. It has a wide usable temperature range of -25 to +125 degrees Celsius, making it suitable for any environment. In addition, the sink is UL/CSA certified, meaning it has met industry safety standards.The ATS-03H-66-C2-R0 heat sink utilizes a unique heat pipe design, which helps to optimize the cooling of the component. The heat pipe is configured into the base of the heat sink with air fin screw assembly. The air fins act as radiators, which passively transfer heat away from the component and into the atmosphere.The ATS-03H-66-C2-R0 is compatible, with many different types of thermal grease, allowing users to mount the heat sink and transfer heat from the component at the same time. It is a dependable, long-term solution for many applications.In addition, the heat sink features a customizable fan design, which can be adjusted to match the requirements of the cooling application. It also offers the user with a range of clip configurations for quicker, easier installation.Anyone looking for an application field with performance, reliability and support may benefit from the ATS-03H-66-C2-R0 heat sink. It is designed to cope with high thermal loads and supply reliable operation for many years. It is a highly effective cooling device for a variety of electronic components.

The specific data is subject to PDF, and the above content is for reference