| Allicdata Part #: | ATS-03H-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a common form of components used to dissipate heat in a variety of thermal systems. The ATS-03H-72-C1-R0 is a type of heat sink designed for use in high powered systems, such as those used in computer processors. This heat sink is designed to provide efficient thermal management, while being compact and low profile allowing for easy installation and maintenance.
The ATS-03H-72-C1-R0 is a relatively small heat sink, measuring only 72 x 45 x 21mm. Despite its small size, the ATS-03H-72-C1-R0 is highly efficient, having a maximal thermal resistance of 0.135°C/W. This enables it to effectively dissipate heat from high powered systems and components without needing a large, bulky heat sink. The ATS-03H-72-C1-R0 is designed for use in computer processor applications, but can also be used in various other applications to dissipate heat in a very efficient manner.
The ATS-03H-72-C1-R0 works by transferring heat away from the component that it is mounted on. This heat transfer is done mainly through the use of aluminum fins, which increase the surface area and enable the heat sink to dissipate more heat. The fins on the ATS-03H-72-C1-R0 are arranged in such a way that the heat is effectively transferred away from the component, while still allowing for maximum surface area. The fins are further enhanced by the use of a thermally conductive adhesive material, which can be applied directly to the component to increase the rate of heat transfer.
Heat sinks of this type are used to improve the thermal management of electrical and electronic components. By dissipating the heat away from these components, the ATS-03H-72-C1-R0 helps to ensure that the components do not become too hot, which can cause them to malfunction. The ATS-03H-72-C1-R0 is also effective at keeping the temperature inside the computer’s case low so that the other components do not overheat as well. This helps to improve the lifespans of all components, as well as reduce the risk of system failures.
The ATS-03H-72-C1-R0 heat sink is an effective and efficient way to dissipate heat from high power components. With its low profile design and thermally conductive adhesive material, the ATS-03H-72-C1-R0 is able to efficiently transfer heat away from the components, while still allowing for a high surface area. This makes it ideal for a variety of thermal applications, from personal computer processors to industrial electronic components. The ATS-03H-72-C1-R0 is also an excellent choice for those who need a compact and efficient solution for their thermal management needs.
The specific data is subject to PDF, and the above content is for reference