| Allicdata Part #: | ATS7373-ND |
| Manufacturer Part#: |
ATS-03H-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03H-80-C2-R0 is a thermal heat sink solution designed for a variety of applications in different computing and industrial equipment. It is designed to draw heat away from a source, and move it to the fin area, aid with airflow and ultimately cooling down. This is a passive heat sink that requires no power to operate.The ATS-03H-80-C2-R0 is constructed using a copper alloy base with bonded aluminum fins. Copper is known for its superior thermal conductivity even at low temperatures. Aluminum is also a good thermal conductor. The combination of these two materials creates an effective thermal solution for efficient and practical heat dissipation.The design of the ATS-03H-80-C2-R0 also includes a number of features to aid with the cooling process. The fin core area consists of optimized fins arranged in a winding spiral pattern to ensure uniform airflow and increased surface area. There is also a protective coating at the base to reduce electrical and magnetic radiation.The ATS-03H-80-C2-R0 is used in applications where ASICs, CPUs, GPUs, and other components produce a lot of heat during operation. The device is designed for use in harsh environments where there is a possibility of dust contamination, or where there is an extremely high amount of heat produced due to long periods of running.In order to work effectively, the ATS-03H-80-C2-R0 should be placed on a flat, clean, and greaseless surface. The base should be firmly attached to the source material. This is best accomplished with a heatsink paste or a thermal pad. Additionally, due to the large surface area of the fin core, there needs to be adequate airflow to ensure efficient cooling.In conclusion, the ATS-03H-80-C2-R0 thermal heat sink is an effective method of drawing and dissipating heat. Its combination of copper alloy base and aluminum fins ensure effective thermal performance. Its design features also help with the cooling process, while the protective coating helps reduce electrical and magnetic radiation. Proper installation is key to ensuring optimal performance, as adequate airflow needs to be maintained.
The specific data is subject to PDF, and the above content is for reference