| Allicdata Part #: | ATS-03H-98-C1-R0-ND |
| Manufacturer Part#: |
ATS-03H-98-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03H-98-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03H-98-C1-R0 is a type of thermal management device, commonly referred to as a heat sink. Heat sinks are used in electronic components to reduce operating temperature and improve device performance and reliability. The ATS-03H-98-C1-R0 is designed for cooling down components with high heat loads in a wide range of applications.
A heat sink dissipates heat by trapping and absorbing the heat generated by the electronic components and dissipating it away, either to the environment or into other components. Heat sinks work by supplying a greater surface area for the heat to pass over or through and by increasing the rate of heat conduction. Heat sinks can be made from materials such as aluminum, copper, and other metals, ceramics, plastics, etc.
The ATS-03H-98-C1-R0 is a heat sink specifically designed for high-power, high-thermal loads. It is especially useful in applications such as audio/video equipment, medical equipment, telecommunications equipment, and industrial automation. The device can be used to cool components with an operating temperature of up to 212°F (100°C).
This heat sink has a low profile design which helps it fit in a compact space and reduces the amount of space needed for installation. It also helps keep components from overheating and potentially damaging other components or the device itself. The heat sink features a copper base for improved thermal conductivity and a high-end heat dissipation capacity.
The ATS-03H-98-C1-R0 is designed to work with an external cooling solution, such as a fan, to help reduce the operating temperature of the device. The device can also be used with a liquid cooling system to reduce the temperature further. It is easy to install and comes with mounting hardware for easy installation.
In conclusion, the ATS-03H-98-C1-R0 is an effective thermal management device designed for cooling components with high heat loads in a wide range of applications. It has a low profile design which helps it fit in a compact space and reduce the amount of space needed for installation. It is easy to install and comes with mounting hardware for easy installation. The device works in tandem with an external cooling solution, such as a fan or liquid cooling system, to help reduce the operating temperature of the device. This makes the ATS-03H-98-C1-R0 an ideal choice for any application that requires effective thermal management.
The specific data is subject to PDF, and the above content is for reference