| Allicdata Part #: | ATS7400-ND |
| Manufacturer Part#: |
ATS-04A-08-C2-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-08-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48138 |
| 25 +: | $ 3.28810 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-04A-08-C2-R0 heat sinks are large and bulky structures, which are built to allow heat transfer from one object to another. They contain lengthy, though quite thin, metal plates which are designed to create large thermal resistances when in contact with a heat source, such as an IC chip. Heat sinks allow cooling of the transistors, providing necessary thermal insulation that enables proper functioning of the ICs.
What is ATS-04A-08-C2-R0?
ATS-04A-08-C2-R0 is a type of heat sink manufactured by Advanced Thermal Solutions, Inc. It is rectangular in shape, and the dimensions are 4” (L) x 8.1” (W) x 0.43” (H). The main purpose of the ATS-04A-08-C2-R0 heat sink is to dissipate heat from an integrated circuit (IC) chip or thermal conditioning device, thus allowing the IC to cool off. The large metal plates provide high thermal resistivities and thus ensure efficient heat transfer from one object to another.
Applications of ATS-04A-08-C2-R0
The ATS-04A-08-C2-R0 heat sink is predominantly used in applications where large cooling devices are not suitable. IC chips, particularly those that are involved in precision-related applications, must be cooled efficiently in order to ensure proper functioning. These applications usually require custom and compact heat sinks that are capable of dissipating heat quickly and evenly. The ATS-04A-08-C2-R0 offers both advantages, making it a suitable choice for such applications. Common applications of this type of heat sink include industrial control systems, telecommunications systems, radar systems, navigation systems, and commercial lighting systems.
Working Principle of ATS-04A-08-C2-R0
The ATS-04A-08-C2-R0 has a working principle similar to other types of heat sinks. Heat is generated from the IC chips and dissipates through the sides of the metal plates. The metal plates have been designed to transfer maximum heat to the environment through their surface areas. As the metal plates absorb heat from the IC chips, a thin layer of air is created between the plates and the IC chips, thus increasing the thermal resistance. As heat continues to be absorbed by the plates, the air layer increases, dissipating heat by convection.
Conclusion
The ATS-04A-08-C2-R0 heat sink is an effective and efficient tool for cooling ICs and other thermal conditioning units. It is a reliable and affordable heat transfer device which is suitable for both large and small applications. The metal plates of the ATS-04A-08-C2-R0 create high thermal resistances, thus creating enough air layers to provide proper cooling. This makes the heat sink an essential component for many industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference