ATS-04A-10-C2-R0

Thermal management is becoming increasingly important, particularly as more aand more electronic devices become smaller and generate more heat in the minimal spaces. Heat sinks are an essential component in this thermal management, as they are responsible for dissipating heat in an efficient and safe manner. One example of a heat sink is the ATS-04A-10-C2-R0, which is well-suited to a wide range of applications and provides optimal thermal performance.

Description

The ATS-04A-10-C2-R0 is a 60mm x 60mm x 20mm aluminium heat sink that features a single anodised aluminium extrusion with a black top, identical side walls, and a number of fins. The heat sink is designed with a 4.6W/mK thermal resistance and is optimised for smaller applications with peak heat loads. In addition, the heat sink has a clearance hole for screws and is supplied with four M3 nuts.

Application Fields

The ATS-04A-10-C2-R0 is suitable for a wide range of applications, from telecommunications to industrial electronics. The heat sink is ideal for use in a limited space where thermal performance is of the utmost importance. In addition, the small size of this heat sink makes it suitable for applications such as LED lighting, servers, and medical devices.

Additionally, the ATS-04A-10-C2-R0 is suitable for heat loads of up to 15W. As such, it can be used for a variety of tasks, including fanless cooling, removing heat from an IC, and moving heat away from critical components in an electronic device. This heat sink is also well-suited for applications such as industrial and telecom equipment, as well as military and aerospace sites.

Working Principle

Heat sinks work by providing a large surface area that can absorb the heat from the components during operation, thus decreasing the temperature of the device. The greater the surface area, the more efficient the heat sink will be. Finned heat sinks work by providing more surface area, which increases the rate of heat exchange. This is done by creating a higher air flow around the fins which helps to dissipate the heat away from the components.

The ATS-04A-10-C2-R0 utilises a small form factor and multiple anodised aluminium fins to achieve maximum thermal performance. The fins are designed to increase the rate of heat exchange, thus providing a higher surface area for heat transfer. Additionally, the presence of the M3 nuts allows for an additional level of cooling efficiency, as they can be used to attach silicon fan mounts or other cooling accessories.

Conclusion

The ATS-04A-10-C2-R0 is an effective and efficient heat sink, and is suitable for a wide range of applications. With its high thermal conductivity and small form factor, this heat sink is ideal for applications where space is an issue and thermal performance is paramount. In addition, the presence of M3 nuts and multiple aluminium fins further increases the efficiency of the heat sink, as they allow for the use of additional cooling accessories.