ATS-04A-115-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04A-115-C1-R0-ND

Manufacturer Part#:

ATS-04A-115-C1-R0

Price: $ 3.23
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04A-115-C1-R0 datasheetATS-04A-115-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.93643
30 +: $ 2.85705
50 +: $ 2.69829
100 +: $ 2.53953
250 +: $ 2.38085
500 +: $ 2.30148
1000 +: $ 2.06339
Stock 1000Can Ship Immediately
$ 3.23
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksHeat sinks are an important part of any electronics system, and the ATS-04A-115-C1-R0 is an exemplary product in this field. This heat sink is designed to efficiently dissipate heat generated by high-powered electronic components, such as CPUs, GPUs, and other components that generate a lot of heat. It is used to help reduce component temperatures, thereby increasing reliability and preventing component damage that can occur due to excessive temperatures.The ATS-04A-115-C1-R0 utilizes a unique design that is optimized for thermal dissipation. It consists of a base plate which is then covered by a series of aluminum fins. The surface area of the fins is designed to maximize the convective heat dissipation, while the thin profile of the fins is designed to minimize air resistance and optimize airflow. This combination of features helps to ensure that the heat is quickly and efficiently dissipated.In order to provide maximum efficiency, the heat sink is designed to be paired with a fan. This fan serves to further increase the rate at which air flows through the heat sink, thus making the entire system even more efficient. The fan should be mounted directly onto the heat sink to ensure optimal performance.In terms of application, the ATS-04A-115-C1-R0 is designed for use with high-powered electronic components such as CPUs, GPUs, and other components that generate a lot of heat. It is specifically designed to handle large amounts of heat, and is therefore suitable for use in industrial or gaming applications where large amounts of heat are generated. It is also suitable for use in data centers where cooling is particularly important.Overall, the ATS-04A-115-C1-R0 heat sink is an ideal solution for those looking for an efficient and reliable way to dissipate heat generated by high-powered electronic components. Its unique design, paired with a fan, ensures that heat is quickly and effectively dissipated, thus helping to ensure the longevity and reliability of electronics systems.

The specific data is subject to PDF, and the above content is for reference

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