| Allicdata Part #: | ATS7436-ND |
| Manufacturer Part#: |
ATS-04A-130-C2-R0 |
| Price: | $ 5.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-130-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.83840 |
| 10 +: | $ 4.70799 |
| 25 +: | $ 4.44604 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is important for effective operation of electronic components and devices. If heat is not adequately managed, it can lead to system failures or the accelerated deterioration of components. Therefore, the ATS-04A 130-C2-R0 thermal management unit is designed to efficiently dissipate heat generated by electronic components.
The ATS-04A 130-C2-R0 thermal management unit is a two-phase heatsink composed of an aluminum radiator and copper heat pipes. The radiator and heat pipes serve as a cooling system that transfers heat from the components to the radiators. The copper heat pipes also ensure that the heat generated by the components is evenly dissipated from the heatsink without localization.
The thermal management unit also features an optimized fin design with fin spacing of 0.2mm. This ensures that the fins have the capacity to dissipate excessive heat more efficiently while reducing air resistance, thus improving heat dissipation. Furthermore, the heat pipes are designed to be soldered directly to the radiator, thus eliminating the need for any additional parts.
The ATS-04A 130-C2-R0 thermal management unit is perfect for cooling application of a wide range of electronic products such as computers, servers, motherboards, video cards, and more. It is also suitable for use in harsh environments where higher temperatures are expected, as the heatsink is engineered to effectively dissipate heat in a wide temperature range of -40°C to 150°C.
In conclusion, the ATS-04A 130-C2-R0 thermal management unit provides efficient and reliable heat dissipation for various electronic components. With its optimized fin design and copper heat pipes, it is able to dissipate heat more efficiently and maintain component temperatures at the desired levels, even in harsh conditions. This makes it the perfect choice for temperature-sensitive applications and other thermal management solutions.
The specific data is subject to PDF, and the above content is for reference