| Allicdata Part #: | ATS-04A-146-C3-R0-ND |
| Manufacturer Part#: |
ATS-04A-146-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-146-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor in the design of any product or system that involves the use of components that generate heat. Heat sinks are devices designed to dissipate heat away from sensitive components. ATS-04A-146-C3-R0 is a type of heat sink designed to provide superior level of thermal management performance. It employs an innovative design that enables it to provide the most efficient thermal management solution possible.
This heat sink is designed to be mounted directly on a PCB (Printed Circuit Board) and features a unique combination of materials to provide excellent thermal performance. The ATS-04A-146-C3-R0 is constructed from a combination of aluminum and copper alloy to produce a highly efficient heat sink that is capable of handling high thermal loads. The aluminum alloy in the base is designed to increase its strength and stability while also providing better thermal conductivity. The copper alloy in the fins increases the surface area to effectively disperse the heat from the component to the environment.
In addition to providing superior thermal performance, the ATS-04A-146-C3-R0 also offers excellent electrical insulation. This is accomplished by using a special thin film of polyethylene which is applied directly to the fins. This thin film is highly insulating, allowing it to protect sensitive components from short circuits or other sources of electrical interference. The thin film also helps reduce noise from the dissipated heat.
The ATS-04A-146-C3-R0 is designed with flexible installation options to make it easy to install in any environment. It includes four mounting holes which can be used to attach the heat sink to virtually any type of PCB. It also includes mounting hardware and thermal pads which allow it to be mounted easily and securely. The heat sink can be positioned in any direction, allowing it to be used in a variety of applications.
The ATS-04A-146-C3-R0 is designed to work in a wide range of environments. It is rated for temperatures up to 205° C, making it suitable for a wide variety of operating conditions. It is also resistant to a variety of external contaminants, such as dust, moisture, and chemicals. This allows the device to be used in harsh environments without the need for frequent maintenance.
The ATS-04A-146-C3-R0 is designed to provide a superior level of thermal management performance in a wide variety of applications. It is suitable for many types of PCBs including computer motherboards, processors, memory modules, and video cards. It is also commonly used to dissipate heat from high-powered components such as power transistors, high voltage capacitors, and resistors. This heat sink is the perfect solution for applications where thermals are critical for the successful operation of the product.
The specific data is subject to PDF, and the above content is for reference