ATS-04A-15-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04A-15-C3-R0-ND

Manufacturer Part#:

ATS-04A-15-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04A-15-C3-R0 datasheetATS-04A-15-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management through efficient and reliable heat dissipating solutions is essential for ensuring the optimal functioning and overall life of electronic devices. Utilizing a heat sink that effectively dissipates heat while having low resistance is critical for ensuring proper cooling. Heat sinks serve as a guard for electronic components and allows for faster and more efficient thermal performance.

The ATS-04A-15-C3-R0 is a heat sink specifically designed to meet the requirements of a wide range of thermal and cooling applications. This heat sink offers a superior performance while consuming a minimal amount of energy. This heat sink is particularly useful for cooling higher powered electronic components, such as processors and LEDs.

The ATS-04A-15-C3-R0 is made from aluminum which provides an effective material for heat dissipation. The aluminum is also used to form the fins that make up the main body of the heat sink. The fins are arranged in a pattern that allows for maximum ventilation as well as the absorption of heat energy. The fins also create turbulence, which helps evenly distribute the heat over the surface area of the fins as well as the base of the heat sink. This helps keep the surface temperature lower and helps to ensure that the heat is evenly distributed.

The ATS-04A-15-C3-R0 also provides an efficient thermal resistance. It has a thermal resistance of 0.15°C/Watt, which allows for efficient cooling. Additionally, it has a low profile and minimal fan noise, as well as a low Power Dissipation (PD) rating, making it suitable for use in even the most compact of electronic devices.

The ATS-04A-15-C3-R0 is also designed with a wide range of applications in mind. It can be used as a general purpose cooling solution for processors, ASICS, FPGAs, and power supply designs. It can also be used for high powered LEDs, gaming PCs, gaming consoles, and other consumer electronic devices that require efficient heat dissipation.

The ATS-04A-15-C3-R0 is one of the most efficient and reliable thermal solutions available on the market. It offers a superior performance while consuming minimal energy, making it an ideal solution for any thermal management application.

The specific data is subject to PDF, and the above content is for reference

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