ATS-04A-159-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an essential component of any electronic system. The ability to dissipate heat efficiently and effectively can optimize the performance of the system. One important device for thermal management is the ATS-04A-159-C3-R0 heat sink. Designed for a range of applications, the heat sink performs the task of dissipating heat through the principles of thermodynamics.

Application Field and Working Principle

The ATS-04A-159-C3-R0 heat sink is well suited for a variety of applications. It is designed to be used in such diverse fields as embedded systems, gaming and computer engineering, medical equipment, military and aerospace, industrial automation, and other specialized systems. The heat sink is able to handle both low power and high power applications that involve components such as microprocessors, circuit boards, power supplies, and graphics cards.The working principle of the ATS-04A-159-C3-R0 heat sink relies on the transfer of thermal energy. Heat is generated by the components in the system that require cooling. This thermal energy is then transferred to the heat sink through a process that is known as convection. This process involves the transfer of the thermal energy from a hotter object to a cooler surface. As the thermal energy is dissipated by the heat sink, the temperature of the components is decreased, ensuring the optimal performance of the system.

Materials and Design

The ATS-04A-159-C3-R0 heat sink is constructed using materials that are designed to ensure optimal thermal transfer and heat dissipation. The material of choice for the heat sink is copper, which is an excellent conductor of thermal energy. Copper is also resistant to corrosion and is a relatively inexpensive material compared to aluminum or other similar metals. The design of the ATS-04A-159-C3-R0 heat sink includes a combination of fins, channels, and embossings that allow for maximum thermal transfer and dissipation. Additionally, the heat sink utilizes the natural air circulation of the system environment to further optimize its performance.

Installation and Maintenance

The ATS-04A-159-C3-R0 heat sink is designed for easy installation and maintenance. The components of the heat sink are held together by high-performance adhesive materials, which eliminates the need for mechanical fasteners. Additionally, the heat sink can be installed using the existing hardware or cable ties for additional support. Once installed, the heat sink should be carefully monitored for any signs of wear or tear over time. Routine maintenance such as dusting the heat sink and ensuring proper airflow should be done regularly to ensure optimal performance.

Conclusion

The ATS-04A-159-C3-R0 heat sink is a highly effective device for thermal management in a variety of applications. Its design is well suited for optimal thermal transfer and heat dissipation. Additionally, its easy installation and maintenance requirements make it ideal for a range of applications in different fields. With its combination of materials, design, and efficient performance, the ATS-04A-159-C3-R0 heat sink is a great choice for any system that requires efficient and reliable thermal control.

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