| Allicdata Part #: | ATS7468-ND |
| Manufacturer Part#: |
ATS-04A-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an important part of many electronic and semiconductor devices. They efficiently dissipate heat from the component to prevent it from overheating. ATS-04A-16-C2-R0 is a type of thermal heat sink that has many applications and an easy to understand working principle.
The ATS-04A-16-C2-R0 heat sink is a thermally conductive, heat dissipation device constructed with aluminum alloy. It is made of a copper core with a black anodized finish, which gives it excellent thermal conductivity and protection against corrosion. A patented R-type design is used to maximize surface area and air flow for efficient heat dissipation. This type of heat sink is suitable for use with high-power, temperature sensitive components like power transistors, regulators, and integrated circuits.
One of the primary applications for the ATS-04A-16-C2-R0 is in mobile phones, tablets, and other handheld devices. The heat sink helps dissipate heat generated by the processor, battery, and other components. By doing so, it ensures that the device does not overheat, which can cause damage or system failure. It is also used to cool components in various industrial machines, such as robotic arms, to ensure optimal performance.
The working principle of the ATS-04A-16-C2-R0 is simple. Heat is generated by the component and then transferred to the heat sink. The aluminum alloy substrate helps spread the heat quickly and efficiently, while the R-type design increases surface area and airflow to maximize heat dissipation. The fins on the heat sink dissipate the heat into the surrounding air, cooling the component and ensuring it operates at an appropriate temperature.
The ATS-04A-16-C2-R0 heat sink is ideal for use in a wide variety of electronic and semiconductor applications. From mobile phones and tablets to robotic arms and industrial machinery, the ATS-04A-16-C2-R0 helps prevent overheating and ensure optimal performance. Additionally, its easy to understand working principle ensures the heat sink will perform reliably and efficiently.
The specific data is subject to PDF, and the above content is for reference