ATS-04A-166-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.18°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionHeat sinks are commonly used in electronic devices to keep the temperature of the device within a desirable range. Heat sinks are devices that use a combination of physical and thermal properties to dissipate the heat that is generated by electronic components. The ATS-04A-166-C2-R0 is a thermal-heat sink that has a wide range of applications and specialized features. ATS-04A-166-C2-R0 OverviewThe ATS-04A-166-C2-R0 heat sink is a compact size with 166mm x 166mm x 10mm of dimensions and a weight of 166g. It is designed to dissipate the thermal energy produced by electronic components, such as microprocessors, transistors, and other devices. This heat sink utilizes advanced extrusion technology and uses special aluminum alloy. It also has an expansion bolt mounting hole and is heat-resistive for longer periods. Application FieldsThe ATS-04A-166-C2-R0 heat sink can be used in a variety of applications. It is designed to work on industrial and commercial applications, such as computers, TVs, projectors, and other related equipment. It is also suitable for home or office applications, such as printers, scanning devices, and other electronic devices. The sturdy construction of the ATS-04A-166-C2-R0 makes it ideal for use in crucial applications, such as those in medical and communication devices. Working PrincipleThe working principle of the ATS-04A-166-C2-R0 is based on the geometry of the radiator, which disperses the heat away from the components. This is done by using a combination of thermal conduction and convection techniques. The device works by transferring thermal energy away from the components through the aluminum material of the heat sink. Since the aluminum material features a high thermal conductivity, it can dissipate the heat more efficiently.The ATS-04A-166-C2-R0 also uses an expansion bolt mounting hole for attaching the device to the circuit board. The expansion bolt helps to ensure that the device is securely attached to the board’s surface. This helps to ensure that the heat sink works as efficiently as possible. ConclusionThe ATS-04A-166-C2-R0 is an excellent thermal-heat sink for applications that require efficient dissipation of thermal energy. The device utilizes advanced extrusion technology and features an expansion bolt mounting hole for secure installation. The ATS-04A-166-C2-R0 is suitable for use in industrial and commercial as well as home and office applications. Its working principle is based on thermal conduction and convection processes that transfer the thermal energy away from the components.

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