ATS-04A-168-C2-R0

Thermal management solutions are important for the long-term reliability and performance of many electrical and electronic components. Heat sinks, which are metal pieces designed to dissipate heat, play a key role in helping these systems maintain temperatures within their own operating parameters. The ATS-04A-168-C2-R0 heat sink from Advanced Thermal Solutions, Inc. (ATS) is a compact, low profile heat sink meant for applications such as high power LEDs and amplifier modules. Its compact design gives it a range of advantages for this particular type of application, while its working principles still adhere to the same underlying concepts as traditional heat sinks.

Application Field

The ATS-04A-168-C2-R0 heat sink is a natural fit for high power LED applications. It has a height of just 0.6 inches and is designed for 1 watt to up to 18 watt dissipations with a 0.51°C/W (°C per watt) thermal resistance. The small size of the heat sink minimizes the space required, giving it a major advantage over traditional, larger heat sinks used in these types of devices. The low profile also ensures that the device is less prone to snagging on other components and PCBs.

The ATS-04A-168-C2-R0 is designed to dissipate heat evenly over its entire surface area, making it an excellent choice for power amplifiers. It’s small size means that more of the amplifier’s power can be concentrated in a relatively small area, where the heat sink can efficiently dissipate it. This low thermal resistance also helps to maximize efficiency and reduce power losses due to the conversion of electrical energy to thermal energy.

Working Principle

At a fundamental level, the working principle of a heat sink is the same regardless of its size or type. They consist of a thermally conductive material, usually aluminum or copper. This material is designed to absorb heat generated by electrical components and dissipate it away from delicate electronics. The actual amount of cooling capacity of the heat sink is determined by its size, surface area, and type of material used. The ATS-04A-168-C2-R0 uses a combination of aluminum alloy and copper to provide efficient heat dissipation.

Heat is removed from the component by conduction, wherein heat is transferred from the component to the heat sink through direct contact. Since heat must flow from the hot component to the cooler heat sink, the heat sink also transfers heat to the environment by a combination of convection and radiation. Optical radiation is the transfer of heat through the air by electromagnetic radiation. Convection occurs as heated air rises, is replaced with cooler air, and the heat transfer cycle is repeated. This process of convection helps the heat sink to dissipate heat away from the device.

An important factor to consider when using a heat sink is how well it transfers and dissipates heat without becoming a source of interference. Heat sinks, especially those with a low profile like the ATS-04A-168-C2-R0, relies on fan assisted cooling to increase its effectivity as a thermal management solution. Fans are used to increase air circulation around the heat sink, helping it to more quickly and efficiently dissipate heat away from the device.

Conclusion

The ATS-04A-168-C2-R0 heat sink is a compact, low profile thermal management solution meant specifically for applications such as high power LEDs and amplifier modules. Its small size and low thermal resistance makes it an ideal choice for these applications, while its underlying working principal of convection, conduction, and radiation still adhere to traditional heat sink principles. This heat sink utilizes fan assisted cooling to ensure that its thermal management is as efficient as possible, making it an excellent choice for these types of devices.