| Allicdata Part #: | ATS7497-ND |
| Manufacturer Part#: |
ATS-04A-186-C2-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-186-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.20840 |
| 10 +: | $ 4.09437 |
| 25 +: | $ 3.86719 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.80°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential parts of cooling and thermal management systems for electronics. A heat sink is a device that absorbs and dissipates heat away from a hot surface, usually utilizing fins to increase increased surface area and heat transfer, especially in air-cooled applications. ATS-04A-186-C2-R0 is a specific type of heat sink designed for high-performance applications, with a range of unique features.
The ATS-04A-186-C2-R0 is a high-efficiency thermal heat dissipator available in both air-cooled and liquid-cooled configurations. The device is constructed from aluminum 6063-T6 material, featuring an anodized finish for improved corrosion resistance. The body of the heat sink is machined from a solid piece of aluminum and features four recessed mounting bosses, allowing it to attach securely to other components without the need for additional hardware.
The ATS-04A-186-C2-R0 heat sink features an elliptical fin arrangement which maximizes surface area and provides increased air flow to effectively convect heat away from a given surface. The use of elliptical fins rather than straight fins also increases the surface area of the device by up to 25%, resulting in improved performance. This elliptical fin design is also reinforced with an oxide layer to provide greater thermal control.
At the heart of the ATS-04A-186-C2-R0 is an innovative thermal management system, utilizing a temperature-controlled air vent which allows air to flow through the heat sink at a constant rate. This air flow is regulated by an adjustable thermoswitch which corresponds with an internal thermal fuse. This unique feature allows the user to adjust the temperature setting to meet their specific needs, with the benefit of increased system safety and reliability.
The ATS-04A-186-C2-R0 also comes equipped with an integrated thermoelectric module, which helps to cool components such as capacitors, transistors and other high powered components. This module utilizes a two-stage cooling process which initially pulls heat away from a given surface, before eventually releasing it into the surrounding air to be dissipated by the heat sink. In addition to this, the module is equipped with a fan speed control system to adjust airflow in response to temperature changes.
The ATS-04A-186-C2-R0 heat sink is an ideal choice for applications which require high levels of thermal control and performance. Its innovative design and features ensure it is capable of effectively cooling and managing temperatures in applications where other heat sinks may struggle. This makes it a perfect solution for a range of electronics cooling and thermal management requirements.
The specific data is subject to PDF, and the above content is for reference