| Allicdata Part #: | ATS7513-ND |
| Manufacturer Part#: |
ATS-04A-200-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-200-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial component of electronic system design since it affects product performance, product reliability, and product life. The ATS-04A-200-C2-R0 is a heat sink for thermal management applications and is designed for efficient heat removal from a variety of electronic components and assemblies. It is ideally suited for use in high performance applications, such as medical electronic equipment, military/aerospace systems, and telecommunications.
The ATS-04A-200-C2-R0 is a lightweight and highly efficient heat sink that can be quickly installed and provides good thermal conductivity. Its unique design enables efficient heat removal with minimal air flow. This heat sink is constructed with extruded aluminum profile and offers superior thermal performance. The ATS-04A-200-C2-R0 combines a base and a finned body for greater thermal performance and a longer life expectancy.
The operation of a heat sink involves the transfer of thermal energy through conduction, convection, and radiation. When the heat sink is installed in an electronic system, the heat generated by the components is absorbed by the base of the heat sink and then transferred by conduction to the finned surface. The fins act like tiny radiators and release the thermal energy into the atmosphere by means of air convection. The rate of heat transfer depends on the design and surface area of the fins. The larger the surface area, the greater the heat transfer. Additionally, the ATS-04A-200-C2-R0 also utilizes a unique C2-R0 shape, which significantly improves the effectiveness of airflow.
The ATS-04A-200-C2-R0 provides excellent thermal performance for a variety of applications. It is suitable for mounting on a variety of PCBs, and it can also be used in combination with other cooling methods, such as a fan or an active cooling system. This heat sink offers great flexibility for different system configurations, as well as superior performance and reliability.
The ATS-04A-200-C2-R0 is an ideal solution for applications requiring fast and efficient heat removal. Its unique design provides excellent performance, while the lightweight and cost-effective construction make it a great choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference