| Allicdata Part #: | ATS7527-ND |
| Manufacturer Part#: |
ATS-04A-24-C2-R0 |
| Price: | $ 5.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronic components is an essential issue in modern, high performance systems. Thermal management solutions have been developed to provide cooling and promote component reliability. ATS-04A-24-C2-R0 is a high performance thermal management solution; its application field and working principle is of great importance to many modern electronic systems.
ATS-04A-24-C2-R0 is an air-cooled, compact heat sink, designed for high-performance thermal management in electronic systems. The heat sink is designed to fit in very compact spaces, and can be mounted onto flat components up to 8.5 cm² in size. The unique design of the heat sink provides superior heat dissipation, allowing systems to run at their full potential.
The working principle of ATS-04A-24-C2-R0 is based on the fact that heat always moves from warmer to colder areas. This heat transfer between systems with different temperatures is known as thermal conduction, or thermal transfer. As electronic components generate heat, the heat dissipates and is transferred away from the component by conduction. The heat is then dissipated by the ATS-04A-24-C2-R0 air-cooled heat sink, allowing for a fast, efficient way to reduce component temperatures.
The application field of ATS-04A-24-C2-R0 is quite wide. It is suitable for all types of electronics, from embedded systems to computers, telecommunication, consumer electronics, and many other applications. Its small form factor and high heat dissipation capabilities make it ideal for confined spaces in embedded system applications. This makes it a great choice for systems that need to operate in cramped environments, and the superior thermal management can help boost their performance.
The ATS-04A-24-C2-R0 is a reliable and efficient thermal management solution for embedded systems and other electronic devices. Its small form factor makes it ideal for cramped and tight spaces, while its superior heat dissipation capabilities ensures that components stay cool under extreme conditions. This makes the ATS-04A-24-C2-R0 heat sink an ideal choice for high performance thermal management.
The specific data is subject to PDF, and the above content is for reference