| Allicdata Part #: | ATS7550-ND |
| Manufacturer Part#: |
ATS-04A-59-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-59-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal management devices used to dissipate heat generated by electronic devices and components. In particular, the ATS-04A-59-C2-R0 is a heat sink designed to efficiently dissipate heat generated by high-power (600W or more) electronic components such as transistors, IGBTs, microprocessors, LED drivers and other high power applications. The ATS-04A-59-C2-R0 heat sink is made from high quality aluminum and utilizes an advanced fin array design to provide excellent cooling performance. The high-strength aluminum fins provide excellent heat conduction capability which helps to quickly and efficiently dissipate heat away from hot components.
The ATS-04A-59-C2-R0 heat sink is a low cost, effective thermal management solution for applications requiring cooling up to 600W or more. The fin array design consists of 2mm thick aluminum fins that are spaced 4.3mm apart. This creates a vast thermal transfer area which allows the heat to be quickly dissipated away from the hot components. In addition to its efficient cooling, the ATS-04A-59-C2-R0 also features high corrosion resistance, and is designed to withstand a wide range of environmental conditions.
The ATS-04A-59-C2-R0 heatsink is designed to be used with a variety of medium-power electronics including IGBTs, MOSFETs, transistors and LED drivers. The heatsink is designed to be mounted directly to the application’s heat source/hot spot, either by using adhesive or by using screws and nuts. This ensures that the heat transfer process is optimized, as the heatsink is in direct contact with the hot spot. When installing the ATS-04A-59-C2-R0 heatsink, the heat source should be insulating to ensure maximum efficiency.
The ATS-04A-59-C2-R0 heatsink is designed to be compact and light-weight, making it ideal for use in applications where size and weight are important considerations. It has a mounting hole size of 4.3mm which allows it to be used with a variety of small to medium-sized electronics. It is also easy to install and has a long service life due to its robust design.
The ATS-04A-59-C2-R0 is an efficient and reliable thermal management device that is an ideal solution for dissipating heat generated by medium-power electronics. The unique fin array design ensures that heat is quickly and efficiently dissipated away from the hot components, making it an ideal choice for a variety of applications. It is also lightweight, compact and easy to install, making it an ideal choice for applications where size and weight are important considerations.
The specific data is subject to PDF, and the above content is for reference