ATS-04A-70-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04A-70-C1-R0-ND

Manufacturer Part#:

ATS-04A-70-C1-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04A-70-C1-R0 datasheetATS-04A-70-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-04A-70-C1-R0 Thermal - Heat Sinks Application Field and Working PrincipleThermal - heat sinks are important components of electronics cooling and efficient air conditioning. Thermal - heat sinks are used to transfer heat from a surface or object to a surrounding environment. Several general principles of thermal - heat sinks are applied in the industry. In this article, the application field and working principle of ATS-04A-70-C1-R0 thermal - heat sinks are discussed.The ATS-04A-70-C1-R0 thermal - heat sinks are primarily used in consumer electronics and audio/video industries. They are designed for cooling high-power electronic components like CPUs, GPUs, and power supplies. The thermal - heat sinks are also used to dissipate the heat generated by light emitting diodes (LED) and components in automotive and aerospace applications. The working principle of ATS-04A-70-C1-R0 thermal - heat sinks relies on the laws of thermodynamics. Heat from the warm surface or object is transferred to the heat sink material, which then dissipates the heat to the environment. Heat sinks often depend heavily on their fins, which increase the surface area of the sink to more effectively disperse the heat. Higher power electronic components often need more fins and more area for efficient cooling. The thermal - heat sinks also use fans to increase the rate of heat dissipation by providing a lower ambient temperature.The design and construction of ATS-04A-70-C1-R0 thermal - heat sinks are critical for effective cooling. These thermal - heat sinks need to be made from high-quality materials like aluminum or copper. They must also be constructed to maximise surface area and air circulation. The fins must have wide angles to capture more airflow and they must also be arranged for optimal performance. The number and size of the fins can affect the rate of cooling. The fans and air vents must also be positioned properly to ensure efficient airflow.The ATS-04A-70-C1-R0 thermal - heat sinks are also designed for efficient installation. They feature mounting brackets or clips to hold them firmly in place. The mount ensures that the thermal - heat sinks stay in place during operation, reducing vibrations and noise. The number and size of the screws may vary depending on the design and power rating of the thermal - heat sink. In conclusion, the ATS-04A-70-C1-R0 thermal - heat sinks are an important part of the cooling systems of many consumer electronics and audio/video systems. They rely on the laws of thermodynamics to transfer heat from the object or surface to the environment. The design and construction of the thermal - heat sinks are essential for effective cooling. The fins and fans need to be properly arranged and sized to increase the area of heat dissipation. The thermal - heat sinks must also feature mounting brackets or clips to hold them firmly in place. With all of these factors in place, ATS-04A-70-C1-R0 thermal - heat sinks can provide efficient cooling in any environment.

The specific data is subject to PDF, and the above content is for reference

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