| Allicdata Part #: | ATS7569-ND |
| Manufacturer Part#: |
ATS-04A-78-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04A-78-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are a critical component of any electronic device. In order to ensure the performance and reliability of devices, heat must be dissipated efficiently and rapidly from these components. ATS-04A-78-C2-R0 is a type of Thermal-Heat Sink developed by a high-quality supplier that is widely used in the industry. This article will discuss the application field and working principle of this thermal-heat sink.
The ATS-04A-78-C2-R0 Thermal-Heat Sink is designed to be used in a variety of applications such as server applications, network switching, and storage devices. It can also be used in the automotive industry, robots and other consumer electronic products. It provides an efficient heat dissipation solution for components that run at high temperatures. As such, it is an ideal choice when it comes to ensuring the smooth operations of devices.
The working principle of this thermal-heat sink is based on the convection principle. When current is passed through the component, the heat generated from this current will be transferred to the surrounding environment. This heat is then quickly dissipated by the Thermal-Heat Sink, thus helping to maintain the temperature of the device. This ensures that the device will operate at optimum levels and with maximum efficiency.
The ATS-04A-78-C2-R0 Thermal-Heat Sink is manufactured with high-grade aluminum radiators and heat pipes which extend inside the component and beyond. This ensures that heat is dissipated as quickly and as efficiently as possible. Furthermore, the heat sink is equipped with high-density fins and advanced cooling technologies for maximum cooling performance. The cooling performance of the thermal-heat sink can be further enhanced by adding additional fans or heat pipes.
The ATS-04A-78-C2-R0 Thermal-Heat Sink also comes in a variety of sizes, allowing it to fit a wide range of applications. These sizes can range from small to large and can be used in any electronic device. Additionally, the Thermal-Heat Sink can also be customized, allowing manufacturers to tailor it to their specific requirements.
In conclusion, the ATS-04A-78-C2-R0 Thermal-Heat Sink is an excellent choice for electronic devices as it provides an efficient and reliable thermal management solution. It is designed with high-performance components and materials and can be used in a variety of applications. It can also be customized to meet the specific needs of a manufacturer.
The specific data is subject to PDF, and the above content is for reference