ATS-04A-81-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04A-81-C3-R0-ND

Manufacturer Part#:

ATS-04A-81-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04A-81-C3-R0 datasheetATS-04A-81-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are a type of cooling device used in electronic components. They work by transferring the heat generated by the components to a large surface area, allowing for efficient cooling of the entire system. The ATS-04A-81-C3-R0 is a thermal-heat sink specifically designed for cooling multichip modules and other applications requiring low thermal resistance.

The ATS-04A-81-C3-R0 is a thermoelectric heat sink which utilizes Heat pipes to transfer heat away from the heatsink. Heat pipes are a type of copper tubing that can transfer the heat generated by an electronic component to the heatsink. By doing so, the thermal resistance of the component is drastically minimized and the system is able to maintain a constant temperature. The ATS-04A-81-C3-R0 is equipped with two separate grooved channels that allow for better heat conduction and the efficient distribution of heat.

The ATS-04A-81-C3-R0 is designed to fit in a standard 19mm tall DIN rail mounted horizontal application. The entire design is made from a die-cast aluminum alloy with integrated heat conduction fins to maximize the heat transfer efficiency. The heat spreader is pressed assembled together with the copper fitted base and provides excellent heat transfer due to its high thermal conductivity. The unit also comes with a special protection coating to reduce corrosion and ensure an extended life.

The ATS-04A-81-C3-R0 is an ideal choice for cooling multichip modules with mid-power output requirements. The unit is designed to be small and compact, easy to install and provides excellent performance. The ATS-04A-81-C3-R0 is designed to work in a wide range of temperatures and is capable of handling up to 85W of dissipated heat. With its low resistance, the ATS-04A-81-C3-R0 is able to cool devices quickly and efficiently.

The customizable feature of the ATS-04A-81-C3-R0 also makes it an ideal choice for a wide variety of applications. The design of the unit allows it to be easily modified to fit the requirements of any application. The unit can be adapted to work with various sizes and shapes of heatsinks, enabling it to be used in a variety of customized ways. Additionally, the customizable design also allows for the addition of different types of fans, making the unit even more thermally efficient.

In summary, the ATS-04A-81-C3-R0 is a thermal-heat sink specifically designed to provide optimized cooling for multichip modules and other applications requiring low thermal resistance. The unit is made from aluminum alloy and comes with integrated heat conduction fins. The unit is small and compact and is customizable to fit many different applications. The ATS-04A-81-C3-R0 is able to provide excellent heat transfer with its low resistance and is capable of handling up to 85W of dissipated heat.

The specific data is subject to PDF, and the above content is for reference

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