ATS-04B-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal-Heat Sinks are devices that are designed to dissipate heat generated by electronic components. They are widely used in various industries and applications, and the ATS-04B-10-C1-R0 is no exception. This particular heat sink is designed for smaller or surface mount devices, and is suitable for a variety of applications, such as military and aerospace. But how exactly does it work? ATS-04B-10-C1-R0 PrinciplesThe ATS-04B-10-C1-R0 works through a series of thermal transfer processes, which help to lower temperatures and reduce the risk of component failure. First, the heat source, such as a processor, is placed in contact with the heat sink. The heat sink is built with a series of fins that create a greater surface area. This increases the rate of thermal conductivity, or the amount of heat energy transferred. As the heat spreader absorbs the heat energy, the fins dissipate the heat into the air, resulting in a lower operating temperature. ATS-04B-10-C1-R0 ApplicationsThe ATS-04B-10-C1-R0 is a popular choice among various industries. It has a wide range of applications, including military, aerospace, consumer, and automotive. In the military, it is used for embedded computing systems and platforms, where space and weight are a major concern. The aerospace industry benefits from the heat sink’s lightweight and relatively small size, making it suitable for air and ground-based applications. Additionally, the ATS-04B-10-C1-R0 is used in consumer electronics such as laptops, tablets, and other computing devices. Finally, the ATS-04B-10-C1-R0 can also be used in the automotive industry due to its small size and high heat dissipation capabilities.ConclusionThe ATS-04B-10-C1-R0 is a versatile, lightweight heat sink that is capable of dissipating heat generated by electronic components. It is suitable for a variety of applications, including military, aerospace, consumer, and automotive. The ATS-04B-10-C1-R0 works through a series of thermal transfer processes, which help to lower operating temperatures and reduce the risk of component failure. This makes the ATS-04B-10-C1-R0 a popular choice among various industries.

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