ATS-04B-10-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal - Heat Sinks are a type of technology that is used to dissipate the heat generated by components. This technology is typically used in a variety of electronic applications ranging from heating, cooling, and analytical testing, to nuclear power generation and more. The ATS-04B-10-C3-R0 is a type of Thermal - Heat Sink that is designed to provide efficient thermal management in a wide range of industrial and military applications. In this article, we will discuss the application field and working principle of the ATS-04B-10-C3-R0.

Application Field of ATS-04B-10-C3-R0

The ATS-04B-10-C3-R0 is a highly efficient Thermal-Heat Sink that can be used in a wide range of applications. Due to its advanced multi-layer design, it can effectively dissipate a large amount of heat, making it ideal for cooling electronics that generate a great deal of heat or in high power applications. The ATS-04B-10-C3-R0 has been designed specifically for use in a variety of military and industrial applications, including military radio, radar, navigational equipment, and satellite ground station tracking devices. Additionally, the ATS-04B-10-C3-R0 can be used in automotive, aerospace, medical, computer, communications, and many other industries due to its ability to properly dissipate even large amounts of heat.

Working Principle of ATS-04B-10-C3-R0

The ATS-04B-10-C3-R0 is a unique type of thermal-heat sink that utilizes a multilayer design to efficiently dissipate heat. This multilayer technology consists of a number of individual layers of both solid and perforated aluminum to ensure that heat is transferred efficiently. The cones or fins on the top layer are designed to dissipate the heat by providing a larger surface area for heat to move away from the component being cooled and into the environment. The solid baseplate then effectively transfers the heat from the cooling area to the perforated base in order to dissipate the resulting heat. The perforated base then allows the heat to be released into the environment.The ATS-04B-10-C3-R0 is designed to be highly efficient and reliable. It has undergone rigorous tests of safety and compliance with prevailing regulations and standards in order to ensure that components will be able to operate without any problems or hazards. Additionally, ATS-04B-10-C3-R0 is designed to meet a variety of thermal management requirements and is tested to ensure that it will work efficiently and effectively even in a range of temperatures.

Conclusion

The ATS-04B-10-C3-R0 is a type of Thermal-Heat Sink specifically designed to provide effective thermal management in a variety of industrial and military applications. It utilizes a multilayer design of solid and perforated aluminum to efficiently dissipate the resulting heat and is tested to ensure that the technology is safe and compliant with existing regulations and standards. The ATS-04B-10-C3-R0 is an effective choice for dissipating the heat generated by electronics and for providing efficient thermal management in a wide range of applications.

The specific data is subject to PDF, and the above content is for reference