ATS-04B-110-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS7612-ND

Manufacturer Part#:

ATS-04B-110-C2-R1

Price: $ 5.59
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-110-C2-R1 datasheetATS-04B-110-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 5.07780
10 +: $ 4.93920
25 +: $ 4.66452
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.59
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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:

Thermal management solutions are becoming increasingly important in everything from laptop computers to industrial machinery. The ATS-04B-110-C2-R1 is a thermal-heat sink designed to provide the right amount of cooling to the desired area. Its application fields and working principles will be identified in this article.

The ATS-04B-110-C2-R1 is optimized for applications that require a thermos cycling process. It is suitable for cooling a wide variety of components, including CPUs and GPUs, as well as other hardware that may require efficient cooling. Its construction features a single-piece solid body that contains an array of specially designed fins. The fins are arranged in a way that maximizes the surface area exposed to air flows, allowing the heat sink to draw as much heat away from the component as possible. This helps to keep the component at its optimal operating temperature.

The working principle of the ATS-04B-110-C2-R1 is relatively straightforward. The device draws heat from the component, and then the heat is dissipated through the fins. This occurs in a process called convection, which takes place when a fluid (in this case, air) is heated and then rises, taking the heat with it. The air is then replaced by cooler air, taking the heat away from the component and allowing it to operate efficiently.

As previously mentioned, the ATS-04B-110-C2-R1 is suitable for a wide range of components and applications, with some of the most common being:

  • Power supplies
  • Batteries
  • Motherboards
  • Graphic cards
  • Memory modules
  • Video cards
  • Hard drives
  • OTDR modules
  • Fiber optic transceivers

In addition to its wide application field, the ATS-04B-110-C2-R1 also offers some other advantages. One of these is its ability to work in a wide range of temperature and humidity levels. This allows it to be used in environments where more traditional cooling options may not be suitable. It also offers a great deal of flexibility when it comes to installation, as the device can be mounted in a variety of different orientations and configurations. This makes it easy to work around tight spaces or challenging layouts.

Finally, the ATS-04B-110-C2-R1 is also capable of testing its own performance. This helps to ensure that the device is performing optimally at all times, as it is able to automatically adjust its settings to match the environment. This helps to ensure that the component will be cooled efficiently and consistently.

Overall, the ATS-04B-110-C2-R1 is an excellent choice for thermal management applications. Its application field is broad, its working principle is straightforward, and its performance testing abilities make it easy to ensure that it is running smoothly at all times. For any application that requires efficient cooling, the ATS-04B-110-C2-R1 is a great choice.

The specific data is subject to PDF, and the above content is for reference

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