ATS-04B-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04B-12-C1-R0-ND

Manufacturer Part#:

ATS-04B-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-12-C1-R0 datasheetATS-04B-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks play an important role in dissipating the heat from electronics and other devices. ATS-04B-12-C1-R0 is a type of heat sink specifically designed for applications that require a high performance thermal solution. The heat sink is made up of a series of aluminum plates that are connected to each other by small fins, allowing for efficient heat transfer and dissipation. In addition, the ATS-04B-12-C1-R0 is designed with an optimized air-flow pattern, ensuring maximum cooling efficiency and performance.The ATS-04B-12-C1-R0 application field and working principle can be divided into two distinct categories. The first is the thermal transfer process, which is the process by which heat is removed from the system. This is achieved by dissipating heat through the heat sink fins. The second field of application is the cooling process, where air is circulated over the fins to dissipate the heat. Air is then drawn away from the heat sink and allowed to escape through a fan or vent.When heat is dissipated through the fins, the heat is conducted to the surface of the aluminum plate, where it is then conducted away from the system and dissipated into the surrounding room air. This process is then repeated over and over, causing the temperature of the system to slowly decrease over time.In addition to dissipating heat, the ATS-04B-12-C1-R0 has other features designed to make it more efficient and effective in the thermal transfer process. For example, the heat sink has a built-in cooling fan that is designed to increase air flow and reduce air noise. Additionally, the ATS-04B-12-C1-R0 also includes a heat spreader that increases the surface area of the heatsink, resulting in better heat transfer across the plates.The ATS-04B-12-C1-R0 application field and working principle can be seen in many different types of configurations. For example, it can be used in the home to cool computer components, or in commercial applications to cool industrial equipment. In addition, the heat sink can be used in automotive applications, since its design is optimized to use air flow to cool sensitive components.In summary, the ATS-04B-12-C1-R0 is an efficient and effective heat sink designed to cool and dissipate heat from electronic devices. The heat sink utilizes an optimized air-flow pattern that dissipates heat rapidly and efficiently, while its heat spreader increases the surface area of the aluminum plates, resulting in improved heat transfer. Additionally, the ATS-04B-12-C1-R0 includes a built-in cooling fan to increase air flow and reduce noise levels, making the heat sink suitable for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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