ATS-04B-134-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS7638-ND

Manufacturer Part#:

ATS-04B-134-C2-R0

Price: $ 7.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-134-C2-R0 datasheetATS-04B-134-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.58350
10 +: $ 6.40773
25 +: $ 6.05203
50 +: $ 5.69596
100 +: $ 5.34001
250 +: $ 4.98401
500 +: $ 4.62801
1000 +: $ 4.53900
Stock 1000Can Ship Immediately
$ 7.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are used as an effective way to dissipate heat from electronics components, such as processors, to avoid damage due to overheating. ATS-04B-134-C2-R0 is a highly efficient natural convection, gravity-assisted aluminum heat sink designed to dissipate moderate amounts of power generated from various electronic components.

The ATS-04B-134-C2-R0 is ideal for applications where a simple natural convection-based solutions are needed such as in TDP-limited devices like CPUs and GPUs, as well as other power components such as FPGAs and ASICs. The heat sink is designed to mount to a flat surface in a vertical orientation, and comes with a set of mounting accessories and clips for easy installation.

The ATS-04B-134-C2-R0 utilizes a nearly sealed recycling air convection design that is able to rapidly and efficiently exchange heat between the thermal sensor elements on the component and the dissipative surface of the heat sink. The design, which is based on natural convection principles such as buoyancy (or “thermal updraft”), is able to use the properties of natural air movements to generate efficient heat distribution and cooling.

The ATS-04B-134-C2-R0 is designed with multiple fan blades which provide an increased surface area and a higher power-cooling performance ratio. The heat sink also features a thermal optimized clutch in conjunction with an advanced fin design which helps to reduce turbulence and noise. The ATS-04B-134-C2-R0 runs at a low noise level to more seamlessly integrate into any environment, while offering efficient thermal transfer rates and higher cooling performance.

The ATS-04B-134-C2-R0 heat sink is also very cost effective and energy efficient, making it an ideal solution for applications where thermal performance and low costs are of paramount importance. The heat sink is designed for compatibility with various computer components, making it an ideal option for multiple product designs. The ATS-04B-134-C2-R0 application fields are extensive due to its versatility, efficient thermal transfer, and cost effectiveness. This makes it an ideal choice for industrial applications such as consumer electronics, automotive electronics, computer hardware, medical, and military applications.

The specific data is subject to PDF, and the above content is for reference

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