ATS-04B-135-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.04°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal-Heat SinksA heat sink is a form of thermoelectric energy device designed to absorb and dissipate heat away from sensitive electrical components and processes. In the context of thermoelectric energy devices, a heat sink is an integral component of many applications, including computer components, industrial equipment, and consumer electronics. The purpose of a heat sink is to efficiently transfer heat by conduction from sources, such as high-energy processors, to a sinking material, such as aluminum. By dissipating heat away from parts of equipment that use high-energy processing or generate excessive amounts of heat, the heat sink ensures that these components remain cool and continue to operate at optimal levels of efficiency.The ATS-04B-135-C3-R0 is a specifically designed, highly efficient, and durable heat sink designed for use in a variety of applications. This model was designed to ensure optimal performance while minimizing energy consumption. The ATS-04B-135-C3-R0 heat sink has a thermal resistance value of 0.135 °C/W, an extended thermal performance of up to 60 W, and a device size of 220 x 130 x 42 mm. This design allows it to fit into tight spaces while maintaining high efficiency in application areas such as consumer electronics, power supplies, and industrial control applications.The ATS-04B-135-C3-R0 utilizes an aluminum base and a series of pin fins that are press-fit onto the base plate. The pin fins increase the surface area which permits for a larger number of air pockets, which generate increased airflow between the fin-stacks, allowing for quicker and more efficient heat dissipation. These fins are also designed to draw heat away from the affixed components and into the base plate, further reducing the thermal waste. Additionally, this heat sink contains a built-in aluminum plate that contains the thermal interface material (TIM) which serves to further reduce thermal resistance.The ATS-04B-135-C3-R0 heat sink is an ideal solution for applications that require high levels of thermal efficiency and durability. It is designed to be mounted onto vertical surfaces, allowing for improved access to components and allowing for improved cooling of parts. The included epoxy glue mount also ensures that the unit will stay securely attached to the mounting surface. The ATS-04B-135-C3-R0 is designed to work in temperatures ranging from -35 to +100 °C. and is RoHS-compliant, meaning it is environmentally friendly and long-lasting. Additionally, this heat sink is designed to be corrosion-resistant, making it perfect for applications in harsh environments.In conclusion, the ATS-04B-135-C3-R0 is a highly efficient and durable thermal-heat sink designed to meet the demands of many applications, including consumer electronics, industrial control equipment, and power supplies. It is designed for increased airflow, improved thermal efficiency, and stability at a range of temperatures. Its mounting system and corrosion-resistant design ensure that it stays securely attached to its mounting surface in even the most hostile environments. The ATS-04B-135-C3-R0 is an ideal solution for customers looking for long-lasting and reliable heat sink solutions.

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