| Allicdata Part #: | ATS-04B-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-04B-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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With the advancement of technology, thermal management solutions in different industries have become more and more of a priority. Although cooling comes in many forms, one of the most commonly used cooling devices is the heat sink. Heat sinks are designed to increase the surface area of a thermal mass, such as a processor, circuit board, or power supply, thereby helping to dissipate and regulate heat. One such example is the ATS-04B-14-C1-R0, a thermal product that can be used for a range of applications.
First developed in the 1960s, the ATS-04B-14-C1-R0 was initially used in the aviation industry. Over time, its popularity has since spread to other industrial and consumer applications. It is a high quality, low cost solution for cooling applications such as industrial electronics, medical devices, and military devices. The device has an efficient heat dissipation capacity with a 0.14mm fin pitch. It also has a good air circulation performance, allowing for an efficient heat transfer.
The base material of the ATS-04B-14-C1-R0 is aluminum, which has a high thermal conductivity, making it one of the most suitable materials for efficient thermal management. Additionally, the aluminum material allows for the device to be lightweight and more cost-effective than other heat sinks on the market.
The ATS-04B-14-C1-R0 is designed to provide effective heat-dissipation by minimizing thermal resistance between the air and the device’s heat-dissipating surfaces. The device features a compact design, which helps to maximize surface area for effective heat transfer. In addition, it uses a unique fin arrangement, which increases the thermal transfer rate and air flow rate.
The device comes in a variety of sizes, making it suitable for various applications. It is also designed to maximize airflow and minimize noise, which is important in many cooling applications. The device also offers compatibility with a variety of heat sources, including processors, circuit boards, and other power supplies.
Overall, the ATS-04B-14-C1-R0 is an effective and reliable thermal management solution. Its lightweight design and flexible installation make it ideal for a range of applications. Furthermore, it is a cost-effective solution, providing efficient heat transfer and noise reduction with minimal power consumption.
The specific data is subject to PDF, and the above content is for reference