| Allicdata Part #: | ATS7647-ND |
| Manufacturer Part#: |
ATS-04B-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal cooling and heat dissipation devices, such as ATS-04B-142-C2-R0, are essential when designing a system. Heat sinks are one of the most important cooling components to control the temperature of the critical system components such as processors, power transistors, and laser diodes, etc. ATS-04B-142-C2-R0 is a high performance heat sink designed to offer effective thermal management in compact electronic equipment.
ATS-04B-142-C2-R0 is an aluminum heat sink designed to dissipate and spread heat generated from electronic components in the device to provide optimum thermal performance. The device consists of multiple fins in an array that are spaced apart to facilitate maximum air flow and heat transfer. It features a long life natural anodized finish and is designed to be corrosion resistant. The fins are machined to a precise size to ensure uniform air flow and heat transfer. The device also includes an integrated mounting bracket which allows for easy installation and removal from the device.
ATS-04B-142-C2-R0 is a highly efficient device for dissipating thermal energy from electronic components. The fins act as a heat sink, and allow for air to move across the fins to dissipate the thermal energy; thus, reducing the temperature of the electronic components. It offers a low profile and has a low thermal resistance of 0.118‖Ω. The device is rated at 206.6W of heat dissipation and offers a maximum air flow of 52CFM. The device also features a patented suspension clip mechanism which ensures fast and easy installation. The device is designed for use in areas with temperatures up to 80℃.
In addition to thermal cooling, ATS-04B-142-C2-R0 also offers EMI (Electro-Magnetic Interference) shielding for components in the same system. The integrated mounting bracket provides reliable EMI shielding which helps to reduce noise and interference from the device. ATS-04B-142-C2-R0 also features a ventilated design which helps to reduce the ambient temperature of the system.
The ATS-04B-142-C2-R0 heat sink is a reliable, high performance device for controlling the temperature of critical system components. It offers superior heat dissipation, EMI shielding, and ventilated design to ensure the reliability and longevity of the system. The device is designed for use in a wide range of applications, including consumer electronics, industrial electronics, telecommunications, and automotive electronics. Thanks to its well-rounded design, the ATS-04B-142-C2-R0 heat sink can be used in a variety of applications and is an ideal choice for applications where power density, efficient thermal management, and environmental requirements are key.
The specific data is subject to PDF, and the above content is for reference