| Allicdata Part #: | ATS-04B-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-04B-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the successful application of electronic devices. Heat generated by a device needs to be dissipated away to avoid thermal overrides and device damage. ATS-04B-15-C3-R0 is a highly specialized thermal - heat sink, specifically designed for cooling electronic devices. It works by moving heat away from the source and into the air or other surrounding material. It is typically found in applications where extreme temperatures are involved, such as in laser printers or power supplies.
The ATS-04B-15-C3-R0 is an anodized black aluminum heat sink that is suitable for overtemperature or overtemperature/overload protection. The heat generated by the source is conducted by the metal fins and dissipated away via the air or other surrounding materials. It is engineered for long-life, low maintenance, and reliable operation. The heat sink utilizes a heat spreader design for increased thermal efficiency. Heat spreaders are made with a thermal interface material (TIM) which is applied between the heat spreader and the heat source. This TIM material helps to spread the heat away from the heat source and transfer it to the metal fins, which in turn dissipate the heat away.
The ATS-04B-15-C3-R0 thermal - heat sink is suitable for a wide variety of applications where efficient heat removal is critical. These include high-power applications such as power supplies, gamers, and high-performance processors, as well as low-power applications such as embedded processors, medical imaging systems, and aerospace electronics. The heat sink is also suitable for use in applications where space or weight are a concern. Its high-pressure aluminum fins are designed to provide efficient cooling even in harsh environments.
The ATS-04B-15-C3-R0 thermal - heat sink is designed to be easy to install and use. The heat sink is compatible with existing clips and brackets as well as custom mountings. It is also compatible with a variety of fan and air cooling devices. The heat sink comes pre-assembled and can be easily mounted onto a chassis or a PCB. Additionally, it is designed to be stackable, enabling efficient and reliable cooling even in limited space.
In conclusion, the ATS-04B-15-C3-R0 thermal - heat sink is a high-performance heat removal solution that is suitable for a variety of applications. It is designed to provide efficient and reliable thermal management, even in harsh environments where space or weight are a concern. The pre-assembled design allows for easy installation and use, while its compatibility with existing clips and brackets (as well as a variety of fan and air cooling devices) enable versatile installation. The heat spreader design ensures efficient heat transfer, while the aluminum fins are designed to provide efficient cooling.
The specific data is subject to PDF, and the above content is for reference