| Allicdata Part #: | ATS-04B-186-C1-R0-ND |
| Manufacturer Part#: |
ATS-04B-186-C1-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-186-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an important issue in modern electronics and equipment due to the increasing temperatures and heat dissipated by the components used to power these systems. Heat sinks are a critical component in a system designed to effectively dissipate the heat generated by electronic components. ATS-04B-186-C1-R0 is a great example of a thermal management heat sink that is designed to effectively manage the extreme temperatures experienced in today’s electronic systems.
ATS-04B-186-C1-R0 is an aluminum alloy heat sink with a copper core. Its features include an intricately designed microstructure that increases the surface area of the heat sink, thus increasing its heat dissipating capabilities. The microstructure is designed to create a turbulent air flow around the block which further enhances its thermal management capability. The alumnium alloy material is also effective at conducting heat away from the electrical components which means that the fan-cooled system is more effective at dissipating heat.
The ATS-04B-186-C1-R0 has been designed for system temperatures up to 125°C. It is a high-performance heat sink, which makes it ideal for applications that require reliable and effective cooling. It has proven to be particularly useful in a variety of applications including computer systems, networking and telecommunications, industrial automation, renewable energy, automotive and aerospace, and embedded systems.
Its performance and reliability are significantly enhanced by its superior fin shapes and heat flux density. This means that the fan-cooled heat sink is able to deliver a high degree of cooling to the system and ensure reliable performance. In addition to its performance gains, the fanless heat sink also reduces system noise levels, making it a great choice for quiet applications.
The ATS-04B-186-C1-R0 is a great example of a heat sink which is designed for reliable and effective thermal management. It features an advanced microstructure for maximum heat transfer and a high-performance finned design for increased heat dissipation. Its fanless design also makes it a great choice for quiet applications. Its highest system temperatures can reach up to 125°C and its reliability and performance are unparalleled. This makes the ATS-04B-186-Cl-R0 an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference