ATS-04B-195-C1-R0 Fans, Thermal Management |
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Allicdata Part #: | ATS-04B-195-C1-R0-ND |
Manufacturer Part#: |
ATS-04B-195-C1-R0 |
Price: | $ 3.13 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X12MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-04B-195-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 2.81736 |
30 +: | $ 2.74134 |
50 +: | $ 2.58905 |
100 +: | $ 2.43671 |
250 +: | $ 2.28446 |
500 +: | $ 2.20830 |
1000 +: | $ 1.97985 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.472" (12.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are items found in many electronic devices. The ATS-04B-195-C1-R0 heat sink is a type that is used in a variety of devices in order to effectively dissipate heat. This heat sink works by providing a surface for heat generated by an electronic component or device to be transferred away from it. This is normally achieved by using a series of metal fins arranged in such a way that the heat can spread from one fin to the next. The heat then dissipates through the fins, which help it spread faster. The ATS-04B-195-C1-R0 heat sink therefore works by cooling the heat generated by an electronic component or device so that it does not cause any damage.
The ATS-04B-195-C1-R0 heat sink works by using a heat spreader and a fan in order to quickly and effectively dissipate the heat generated by a device. The heat spreader is typically made out of a copper alloy and is designed to spread the heat from the electronic components it\'s attached to evenly across the surface of the heat sink. The fan then pushes the air around the heat spreader and creates a convection effect which helps to quickly remove the heat from the components. The combination of the fan and the heat spreader help to dissipate the heat and keep the device from overheating.
The ATS-04B-195-C1-R0 heat sink is most commonly used in computer systems, although it can be used in a variety of other applications as well. This type of heat sink is designed to be able to dissipate the heat generated by a wide range of components such as processors, GPUs, memory chips, and other types of chips. It is also designed to be able to handle high temperatures which can occur when these components are placed in a confined space or when they are put under high loads. This means that the ATS-04B-195-C1-R0 heat sink is often used in devices and systems that require high-performance or need to run for extended periods of time. The ATS-04B-195-C1-R0 heat sink is also often used in high-end gaming systems that need to be kept cool in order to maintain optimal performance.
In terms of installation, the ATS-04B-195-C1-R0 heat sink is fairly simple to install and does not require any complicated tools or techniques. Most people will be able to install the heat sink in a short amount of time, and it can easily be added to existing cooling systems or new ones. It does not require any additional mounting hardware, and the heat spreader and fan can easily be attached to the device.
In conclusion, the ATS-04B-195-C1-R0 heat sink is an incredibly useful tool in dissipating the heat generated by electronic components. It is designed to be able to handle high temperatures and to dissipate the heat from multiple components without causing any damage. It is easy to install, and it is highly effective in cooling a variety of devices and systems. Therefore, the ATS-04B-195-C1-R0 heat sink is a great choice for anyone looking for a reliable and efficient way to cool their electronic components.
The specific data is subject to PDF, and the above content is for reference