| Allicdata Part #: | ATS-04B-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-04B-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical consideration for many electronic components. Heat generated by electronic components needs to be quickly and efficiently dissipated to ensure a reliable and safe operation of the electronic components. The ATS-04B-24-C3-R0 is an advanced thermal-heat sink specifically designed to meet the demanding requirements of thermal management for many electronic components.
The ATS-04B-24-C3-R0 is a highly efficient passive thermal-heat sink constructed from aluminum and copper alloy. It consists of a large aluminum plate, a small copper plate, and an array of cooling fins. Through the combination of copper and aluminum Conductive Materials, the heat generated by the electronic components is efficiently dissipated through the copper plate and then dissipated into the air by the aluminum cooling fins.
The unique design and materials used to manufacture the ATS-04B-24-C3-R0 thermal-heat sink makes it suitable for use with many different types of electronic components. This versatility makes the ATS-04B-24-C3-R0 an ideal choice for applications that require a reliable and efficient method of dissipating the heat generated by the electronic components.
The ATS-04B-24-C3-R0 is designed to dissipate heat from components such as semiconductor chips, IGBTs, and power resistors; as well as other types of electrical components. The high thermal conductivity of the ATS-04B-24-C3-R0 ensures that heat is dissipated quickly and efficiently. This makes the ATS-04B-24-C3-R0 a great option for applications that involve a large amount of heat production or that require a high degree of thermal management.
The ATS-04B-24-C3-R0 was specifically designed to provide a reliable and efficient method of dissipating heat from many electronic components. The combination of the copper and aluminum materials increases the thermal conductivity of the thermal-heat sink allowing it to quickly and efficiently dissipate heat from the electronic components. The use of cooling fins also increases the thermal conductivity of the thermal-heat sink as it allows the air to better circulate around the electronic components.
The ATS-04B-24-C3-R0 is a reliable and effective method of dissipating heat from electronic components. The combination of copper and aluminum materials ensures a high degree of thermal conductivity allowing the heat generated by the electronic components to be quickly and efficiently dissipated into the air. With the use of cooling fins, the air is also able to better circulate around the components, further improving the thermal management of the components. The ATS-04B-24-C3-R0 is a reliable and efficient method of dissipating heat from many electronic components and is an ideal choice for applications that require a high degree of thermal management.
The specific data is subject to PDF, and the above content is for reference