ATS-04B-51-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04B-51-C3-R0-ND

Manufacturer Part#:

ATS-04B-51-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-51-C3-R0 datasheetATS-04B-51-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal heat sinks are devices designed to transfer heat from one component to another, as well as to dissipate heat from a given source such as an electronic component, a computer processor, or a motor. ATS-04B-51-C3-R0 is a type of thermal heat sink designed specifically for cooling applications. This type of heat sink utilizes a combination of materials and components to effectively transfer thermal energy away from the source and into the surrounding environment.

Application

ATS-04B-51-C3-R0 thermal heat sinks are primarily designed for cooling applications. They are typically used in areas where temperature fluctuations can occur due to changing environmental conditions or unusually high workload. As such, the thermal heat sink helps to ensure that all components within the system remain at their optimal temperatures. Common application of this type of heat sink include but are not limited to computers, networking equipment, industrial systems, automotive electronics, and gaming consoles.

Physical Design

The ATS-04B-51-C3-R0 thermal heat sink features a robust, multi-beam aluminum construction. This design helps to maximize surface area, allowing for more efficient cooling of the components. Additionally, this type of heat sink also features a low-profile design, which helps to keep the overall system size and weight minimized while still providing sufficient cooling performance.

Working Principle

The ATS-04B-51-C3-R0 thermal heat sink utilizes the air-to-air convection method of heat transfer. This type of heat transfer is based on the principles of convective heat transfer, which states that heat is transferred from a hotter object to a cooler one. In this case, the heat generated by the components is transferred from the components to the environment via the thermal heat sink. The thermal heat sink serves to cool the components by drawing the heat away from them and into the environment. This is achieved through the use of multiple heat fins or heat pipes, which serve to dissipate the heat from the components and into the surrounding air.

Advantages

The ATS-04B-51-C3-R0 thermal heat sink offers several advantages over other types of thermal cooling solutions. First, this type of heat sink is highly efficient and can dissipate large amounts of heat efficiently. Second, it is lightweight and requires minimal installation, making it ideal for use in tight spaces and limited-space applications. And third, since it is made of aluminum, it is also highly durable and resistant to corrosion and oxidation, making it ideal for use in industrial or harsh environments.

Conclusion

The ATS-04B-51-C3-R0 thermal heat sink is a robust and efficient solution for thermal cooling applications. This type of heat sink takes advantage of convective heat transfer principles to dissipate large amounts of heat, while also being lightweight and requiring minimal space. Additionally, since it is made of aluminum, it is also highly durable and resistant to corrosion and oxidation.

The specific data is subject to PDF, and the above content is for reference

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