ATS-04B-60-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04B-60-C3-R0-ND

Manufacturer Part#:

ATS-04B-60-C3-R0

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-60-C3-R0 datasheetATS-04B-60-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.95577
30 +: $ 3.73611
50 +: $ 3.51628
100 +: $ 3.29654
250 +: $ 3.07677
500 +: $ 2.85700
1000 +: $ 2.80206
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-04B-60-C3-R0

Thermal-Heat Sinks are an important part of any electronics project, as they disperse heat away from sensitive components. ATS-04B-60-C3-R0 is a type of Thermal-Heat Sink that is specifically designed for an array of applications.

Application Field

The ATS-04B-60-C3-R0 is designed for applications such as motor control, power management, industrial instrumentation and transmission, and audio and video signal control. It is designed to provide a fast and efficient way to dissipate heat away from critical components in order to ensure the safety of the circuitry.

Furthermore, the ATS-04B-60-C3-R0 is also suitable for applications in humid environments, as it is resistant to corrosion. Its high thermal stability ensures the long-term reliability of the product, making it a valuable solution for a wide range of applications.

Working Principle

The ATS-04B-60-C3-R0 is made from an advanced thin-film thermal exchange material called "heat sink foil". This material is composed of aluminum alloy and copper alloy layers. When electrical energy passes through the aluminum layer of the foil, it is absorbed by the material and then dissipated as heat. This heat is then dissipated through the copper alloy layers of the foil, which act as efficient heat conductors to keep the critical components cool.

In addition, the ATS-04B-60-C3-R0 also comes with a high-purity aluminum alloy plate that serves as an effective heat spreader. This plate is designed to expand the effective area of heat distribution over the entire surface of the thermal foil, ensuring maximum efficiency.

The ATS-04B-60-C3-R0 also comes with a specially designed air-flow channel that ensures air flow around the heat sink foil. This channel helps to ensure uniformed heating and cooling in order to further improve the effectiveness of heat dissipation.

Conclusion

The ATS-04B-60-C3-R0 is an advanced heat sink solution designed for a wide range of applications. It is made from a high-performance thermal exchange material that is highly efficient in dissipating heat away from critical components. It also comes with a specially designed air-flow channel to improve air flow around the heat sink and improve the effectiveness of heat dissipation. Therefore, the ATS-04B-60-C3-R0 makes an excellent choice for applications that require superior thermal-heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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