| Allicdata Part #: | ATS-04B-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-04B-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are important components in almost any modern technology. They are used to dissipate heat created by processes like CPU computation or hard drive operations. In this way, they help keep components cool, preventing overheating and failure of sensitive components.
One such example is the ATS-04B-63-C1-R0 heat sink. This heat sink is a compact aluminum heatsink and fan system, designed to cool down high-performance electronics like CPUs and other processor-intensive components. It employs a fan that draws warm air away from the component into the surrounding metal enclosure, dissipating heat generated by components more reliably and efficiently than conventional cooling methods.
The ATS-04B-63-C1-R0 is a great choice for cooling components that require a lot of power. It comes with a low-profile design that makes it suitable for tight spaces, such as in a laptop or small form-factor PCs. By drawing heat away from the component, it prolongs its life and helps keep it running cooler and smoother.
The ATS-04B-63-C1-R0 is made from an aluminum baseplate, a series of fins and some thermal pads. The baseplate provides the heat sink’s foundation and also serves to attach the heatsink to the component. The fins are designed to draw air through the heat sink and disperse it away from the component. They effectively act as a large area for exchanging heat energy, and as a result, the component’s heat is effectively dissipated away.
The ATS-04B-63-C1-R0 is perfect for components that generate high amounts of heat. Its cooling efficiency is maximized when using only one fan, as the more fans you use, the more noise the system produces. The fan’s orientation is also important, as it should be positioned so that it draws air into the component rather than away from it. This ensures that all of the heat generated is dissipated away efficiently.
The ATS-04B-63-C1-R0 is a great choice for cooling down high performance electronics, such as CPUs. Its efficient design and low-profile design makes it suitable for tight spaces. And its fan orientation and cooling architecture helps dissipate heat more quickly and reliably than conventional cooling methods. As a result, it is an excellent choice for any application that requires improved cooling of components.
The specific data is subject to PDF, and the above content is for reference