ATS-04B-64-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-04B-64-C3-R0 heat sink is an example of a thermal-heat sink. It is a cooling solution primarily used with electrical systems, and is designed to help remove heat from these components, making them run more efficiently and for longer periods of time. The heat sink is comprised of a series of components, including a base, a large fin array, and various heat pipes and heat spreaders. This combination of elements works together to effectively dissipate heat created by connected components. By leveraging air convection and passive heat transfer, the heat is moved away from the component and into the atmosphere wherever the fin array is exposed to air. The heat sink is capable of aiding in the cooling of any component within a typical range of temperatures. This includes anything from printed circuit boards to power transistors and any other form of excess heat generating components.

The ATS-04B-64-C3-R0 has been adopted by many technology companies as an ideal solution for cooling higher powered electrical components. Its usage has been seen in a variety of settings, such as car audio, home theater and gaming consoles. It is also useful for other components such as power supplies, LED lighting, and computer processors. The thermal heat sink is suitable for many applications and offers several benefits. It is an effective and efficient cooling option as the thermal design helps spread the heat evenly throughout the fin array which reduces the risk of component failure. With a lightweight design, the ATS-04B-64-C3-R0 can be easily installed in tight spaces and is easy to maintain and keep clean. The design also features a trade-off between performance and noise, as there is no fan or noise generating component required to work with the heat sink.

The ATS-04B-64-C3-R0 works on the basis of air convection and passive heat transfer. Heat from the component is dissipated through a metal base plate. The base plate is then connected to the fin array which fans out from the base plate into multiple aerodynamically designed fins. Heat transfer takes place when air passes over the exposed fin array. The fins increase the surface area of the base plate which allows more heat to be absorbed by the surrounding air. The heat is taken away from the device where it is either reflected away or passed through an air gap between the fins to cooler areas of the air.

The combination of air convection and passive heat transfer makes the ATS-04B-64-C3-R0 an effective and reliable heat sink for cooling electrical components. Its lightweight design allows it to be quickly and easily installed, making it an ideal choice for any application that requires a reliable and efficient way to manage thermal heating. The fin array’s aerodynamic design helps keep heat away from the electrical components, while the added surface area of the fins allows for better heat absorption. The cooling performance of the ATS-04B-64-C3-R0 is also enhanced due to the fact that it does not need a fan or other noise generating components to function. As a result, this heat sink can provide reliable, efficient, and silent cooling.

The specific data is subject to PDF, and the above content is for reference