ATS-04B-73-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-04B-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-04B-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management device used in a variety of applications to dissipate heat from electronic components as well as from internal structures and other surface areas. Heat sinks are used in many industries, from automotive and medical to aerospace, from semiconductor fabrication to telecommunications, from PC motherboards to industrial automation. The ATS-04B-73-C1-R0, a heat sink, is designed for dissipating heat in applications where higher thermal loads – such as LED lighting modules - require the heat sink to have a large surface area and high efficiency capability.
The ATS-04B-73-C1-R0 is composed of a body with a series of longitudinal fins which form eaves. It has a heat pipe in the center, which is used to efficiently transfer heat away from other components. The metal fins of the heat sink act as an efficient heat path for heat to be expelled from the device while the heat pipe is a heat conduction tool, allowing heat to be transferred easily between the heat sink and other components. The use of both the fins and the heat pipe allows the heat sink to efficiently dissipate heat when compared to heat sinks without these components.
The ATS-04B-73-C1-R0 has been designed to excel in thermal managing applications, providing an effective way to move heat away from components, including LEDs and other high temperature devices. This heat sink can be used to dissipate large amounts of heat and provide protection for delicate components. The fins provide a large surface area which is used to disperse heat more quickly, and the heat pipe works to transfer the heat away from the source before it can damage any components.
The ATS-04B-73-C1-R0 also has air flow optimization capabilities. The fins are not only designed to direct heat away from the source but also to reduce air flow turbulence. This feature prevents pockets of air from forming around the heat sink, which can reduce its efficiency. The fanless design of the ATS-04B-73-C1-R0 also makes it suited for applications where silence and high efficiency are a priority.
The ATS-04B-73-C1-R0 is a thermal-efficient heat sink that can be used in various applications, from lighting to manufacturing, to dissipate large amounts of heat in an efficient manner. The fins and heat pipe design of the ATS-04B-73-C1-R0 provide an effective way to move heat away from components, while the air flow optimization prevents pockets of warm air from forming and reducing the efficacy of the heat sink. This makes it a suitable choice for applications requiring a large amount of cooling, such as LED lights, and applications where silence and high efficiency are a priority.
The specific data is subject to PDF, and the above content is for reference