| Allicdata Part #: | ATS-04B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-04B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are components of thermal management systems used to cool electronic components and systems. The ATS-04B-76-C3-R0 is a versatile, high performance heat sink suited for a wide range of applications. This article will discuss the application field and working principle of the ATS-04B-76-C3-R0.
The ATS-04B-76-C3-R0 is designed to dissipate heat up to 15W with superior performance in temperature controlled applications. The heat sink has an aluminum base attached to a fin stack, and it utilizes air convection and conduction to move heat away from the source. It is compatible with more than 20 different socket types, making it an ideal choice for a variety of applications. It is also small and lightweight, making it easy to mount and transport.
The ATS-04B-76-C3-R0 is ideal for cooling electronics in a wide range of applications including automotive, medical, industrial, robotics, consumer electronics, and telecom. Additionally, it can be used for higher-wattage power supplies, CPUs, GPUs, and other high-powered chipsets. Its superior performance makes it well suited for temperature-controlled applications, such as machinery, telecommunications switchgear, and industrial processing systems.
The ATS-04B-76-C3-R0 utilizes a combination of air convection and conduction to transfer heat away from the source. The device consists of a base and a fin stack. The fin stack is composed of a series of vertical fins that increase the surface area of the heat sink, allowing it to dissipate heat more efficiently. Heat is transferred from the source to the aluminum base and then transferred through the fins to the surrounding air. This process is known as natural convection and helps the heat sink to maintain a more even temperature distribution across the source.
In addition to air convection, the ATS-04B-76-C3-R0 also utilizes conduction for heat transfer. This is accomplished through a thermal grease, which is applied between the base of the heat sink and the source. The thermal grease helps to reduce the contact resistance between the parts, allowing for more efficient heat transfer. The amount of thermal grease used should be carefully monitored to ensure optimal performance.
The ATS-04B-76-C3-R0 is an excellent choice for a wide range of thermal management applications. Its compatibility with more than 20 different socket types makes it a versatile choice for any application. Additionally, its superior performance for temperature-controlled applications makes it particularly well suited for industrial, robotics, and telecom applications. The combination of air convection and conduction helps to efficiently manage heat transfer, making the ATS-04B-76-C3-R0 a reliable and efficient choice for your thermal management needs.
The specific data is subject to PDF, and the above content is for reference