| Allicdata Part #: | ATS-04B-81-C1-R0-ND |
| Manufacturer Part#: |
ATS-04B-81-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04B-81-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04B-81-C1-R0 is a specialty Thermal - Heat Sink that is designed to remove and transfer heat away from electrical and electronic components. The product’s primary application is the removal of heat from semiconductor devices such as integrated circuits, transistors, and diodes. It also provides an ideal solution for applications that require high-efficiency heat dissipation without the need for high air pressure or large surface area. This makes it an ideal solution for thermal management in PC enclosures, telecom systems, and instrument and test equipment.
The ATS-04B-81-C1-R0 incorporates a unique three-phase heat transfer system that operates by utilizing convection. The three-phase system works by taking in heat from the semiconductor components and transferring it through a combination of conduction and convection to the air outside. Heat exchange is achieved through the use of two separate heat sinks, one made from aluminum and the other made from copper, with the aluminum sink providing the primary source of heat dissipation and the copper sink providing the secondary source.
The unique design of the ATS-04B-81-C1-R0 facilitates a very efficient and robust thermal transfer process. It is capable of providing up to 50 watts of power dissipation and is equipped with its own fan to ensure adequate airflow. The fan can be configured to run at various speeds to further optimize heat transfer efficiency. Furthermore, the ATS-04B-81-C1-R0 is capable of operating over a wide temperature range, allowing it to be used in a variety of applications.
When selecting an ATS-04B-81-C1-R0 for a specific application, it is important to take into consideration the operating environment, performance requirements, and thermal load. For maximum efficiency and reliability, the product should be correctly sized to match the thermal load and operating environment. Additionally, the product should be properly installed and tested to ensure optimal performance.
In summary, the ATS-04B-81-C1-R0 is an efficient and reliable Thermal - Heat Sink with a unique three-phase heat transfer system. Its primary application is the removal of heat from semiconductor components, but it is also suitable for a variety of other thermal management applications. The unique design and superior thermal performance make it an ideal solution for any application requiring efficient and reliable heat dissipation.
The specific data is subject to PDF, and the above content is for reference