ATS-04C-02-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04C-02-C1-R0-ND

Manufacturer Part#:

ATS-04C-02-C1-R0

Price: $ 3.20
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04C-02-C1-R0 datasheetATS-04C-02-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.91249
30 +: $ 2.83395
50 +: $ 2.67649
100 +: $ 2.51899
250 +: $ 2.36157
500 +: $ 2.28284
1000 +: $ 2.04668
Stock 1000Can Ship Immediately
$ 3.2
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-04C-02-C1-R0 is a thermal heat sink that is widely used in the industry. It is designed for applications that require efficient cooling of components that operate at high temperatures. The ATS-04C-02-C1-R0 is made from metal with good thermal conductivity, such as aluminum, which helps to transfer the heat away from the component to the surrounding environment. The thermal heatsink has fins that increase the heat dissipation area and allow air to flow over the fins for faster cooling.

The thermal heat sink also has a base plate that helps to transfer the heat from the component to the fins of the heatsink. The base plate also helps to reduce the contact area of the component and heat sink, which increases the efficiency of the heat transfer. The fin design of the thermal heater sink is optimized to increase the heat dissipation area, maximizing the cooling effect of the heatsink.

The thermal heat sink is also designed to be easy to install. The heatsink can be easily mounted to a circuit board or component. It is also compatible with many other components that require high thermal performance. The thermal heat sink is designed to be lightweight and durable, making it easy to install and maintain.

The ATS-04C-02-C1-R0 is a great choice for applications that require effective cooling of components. It features a high-efficiency design and robust construction, allowing for reliable operation in high-temperature environments. With its impressive thermal performance, the ATS-04C-02-C1-R0 thermal heat sink is an ideal solution for applications that require efficient cooling.

The specific data is subject to PDF, and the above content is for reference

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